EP 1031175 B1 20030423 - PROCESS AND DEVICE FOR CONNECTING A PROBE TO A PRINTED CIRCUIT BOARD BY MEANS OF A PLUG CONNECTOR WITH TWO HALF-SHELLS
Title (en)
PROCESS AND DEVICE FOR CONNECTING A PROBE TO A PRINTED CIRCUIT BOARD BY MEANS OF A PLUG CONNECTOR WITH TWO HALF-SHELLS
Title (de)
VERFAHREN UND VORRICHTUNG ZUM VERBINDEN EINER SONDE MIT LEITERPLATTE MIT EINEM AUS ZWEI HALBSCHALEN BESTEHENDEN VERBINDUNGSSTECKER
Title (fr)
PROCEDE ET DISPOSITIF POUR RELIER UNE SONDE A UNE CARTE DE CIRCUITS A L'AIDE D'UNE FICHE DE CONNEXION COMPOSEE DE DEUX SEMI-COQUES
Publication
Application
Priority
- DE 9901477 W 19990518
- DE 19828314 A 19980625
Abstract (en)
[origin: WO9967856A1] A process is disclosed for connecting a probe having electrical connections that end on a printed circuit board that can be inserted into a receptacle of a plug connector composed of two half-shells which carry on their mutually facing sides matching contacts for the connections of the printed circuit board, form an intermediate receptacle for the printed circuit board and are kept together by the pressure of a U-shaped spring that encloses them. The connection can be substantially simplified, without any risk of damage to the parts, in that the plug connector is inserted between two adjustable jaws and positioned in such a way that spreading projections of the adjustable jaws are aligned with the opening of the spring, the spring is spread apart over a predetermined path of displacement by displacing in opposite directions the spreading projections inserted into the opening of the spring, the printed circuit board is inserted into the thus widened receptacle between the half-shells and then retained between the half-shells of the plug connector by the pressure of the released spring after the spreading projections are set back and/or retracted.
IPC 1-7
IPC 8 full level
H01R 12/85 (2011.01); H01R 43/26 (2006.01)
CPC (source: EP KR US)
H01R 12/85 (2013.01 - EP US); H01R 43/26 (2013.01 - EP US); H01R 43/28 (2013.01 - KR); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49144 (2015.01 - EP US); Y10T 29/53178 (2015.01 - EP US); Y10T 29/53209 (2015.01 - EP US)
Designated contracting state (EPC)
CH DE ES FR GB IT LI
DOCDB simple family (publication)
WO 9967856 A1 19991229; DE 19828314 C1 20000224; DE 59905178 D1 20030528; EP 1031175 A1 20000830; EP 1031175 B1 20030423; ES 2198142 T3 20040116; JP 2002519822 A 20020702; KR 20010022746 A 20010326; US 6446332 B1 20020910
DOCDB simple family (application)
DE 9901477 W 19990518; DE 19828314 A 19980625; DE 59905178 T 19990518; EP 99936258 A 19990518; ES 99936258 T 19990518; JP 2000556425 A 19990518; KR 20007001345 A 20000209; US 48627900 A 20000519