EP 1031413 A3 20010221 - Radiation-sensitive recording material for the production of waterless offset printing plates
Title (en)
Radiation-sensitive recording material for the production of waterless offset printing plates
Title (de)
Strahlungsempfindliches Aufzeichnungsmaterial zur Herstellung von Wasserlos-Offsetdruckplatten
Title (fr)
Matériau d'enregistrement sensible aux radiations pour la fabrication de plaques d'impression offset sans eau
Publication
Application
Priority
DE 19908528 A 19990226
Abstract (en)
[origin: EP1031413A2] An infrared-sensitive recording medium comprises in sequence: (a) a support; (b) a primer layer comprising a mixture of an unmodified epoxy resin (I), a functionalized polymer (II) and a crosslinking agent that reacts with (I) and (II); (c) an infrared-sensitive layer; and (d) a silicone layer. An Independent claim is also included for a process for producing a plate for waterless offset printing, comprising irradiating the recording medium imagewise with infrared radiation (preferably laser radiation) and removing ablated material with water or an aqueous solution.
IPC 1-7
IPC 8 full level
B41C 1/10 (2006.01); B41N 1/14 (2006.01); G03F 7/00 (2006.01); G03F 7/004 (2006.01); G03F 7/075 (2006.01)
CPC (source: EP US)
B41C 1/1016 (2013.01 - EP US); B41C 2210/04 (2013.01 - EP US); B41C 2210/14 (2013.01 - EP US); B41C 2210/16 (2016.10 - EP US); B41C 2210/22 (2013.01 - EP US); B41C 2210/24 (2013.01 - EP US); B41C 2210/26 (2013.01 - EP US)
Citation (search report)
- [A] EP 0897795 A1 19990224 - TORAY INDUSTRIES [JP]
- [A] WO 9831550 A1 19980723 - AGFA GEVAERT NV [BE]
- [A] US 4861698 A 19890829 - HIRUMA TOSHIHIKO [JP], et al
- [A] EP 0764522 A2 19970326 - SUN CHEMICAL CORP [US]
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1031413 A2 20000830; EP 1031413 A3 20010221; EP 1031413 B1 20040428; DE 19908528 A1 20000831; DE 50006200 D1 20040603; JP 2000250202 A 20000914; US 6576399 B1 20030610
DOCDB simple family (application)
EP 00103354 A 20000222; DE 19908528 A 19990226; DE 50006200 T 20000222; JP 2000051888 A 20000228; US 50495200 A 20000216