Global Patent Index - EP 1032474 B1

EP 1032474 B1 20011017 - METHOD FOR MULTI-LAYERED REPAIR COATING OF SUBSTRATES

Title (en)

METHOD FOR MULTI-LAYERED REPAIR COATING OF SUBSTRATES

Title (de)

VERFAHREN ZUR MEHRSCHICHTIGEN REPARATURLACKIERUNG VON SUBSTRATEN

Title (fr)

PROCEDE DE REPARATION LAQUAGE MULTICOUCHE DE SUBSTRATS

Publication

EP 1032474 B1 20011017 (DE)

Application

EP 98955544 A 19981105

Priority

  • DE 19751478 A 19971120
  • DE 19757082 A 19971220
  • EP 9807082 W 19981105

Abstract (en)

[origin: US6531188B1] Process for producing a multi-layer lacquer finish, in which a surfacer coating compound is applied to a substrate optionally pre-coated with a priming layer and/or further coating layers, and a top coating comprising a color-imparting and/or special-effect-imparting base lacquer layer and a transparent clear lacquer layer, or a top coating comprising a pigmented one-layer top lacquer, is then applied, in which the surfacer coating compound which is used is one which either contains binders which are curable exclusively by free radical and/or cationic polymerization, wherein the said binders are cured by means of high-energy radiation, or is one which contains binders which are curable by free radical and/or cationic polymerization, wherein the said binders are cured by means of high-energy radiation, and additionally contains chemically cross-linking binders.

IPC 1-7

B05D 7/00; B05D 3/06; B05D 5/00

IPC 8 full level

B05D 7/14 (2006.01); B05D 3/06 (2006.01); B05D 5/00 (2006.01); B05D 7/00 (2006.01); C08F 2/46 (2006.01)

CPC (source: EP US)

B05D 3/067 (2013.01 - EP US); B05D 5/005 (2013.01 - EP US); B05D 7/54 (2013.01 - EP US); B05D 7/57 (2013.01 - EP US)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IT LI NL PT SE

DOCDB simple family (publication)

US 6531188 B1 20030311; AT E206960 T1 20011115; CA 2310716 A1 19990603; CA 2310716 C 20070522; DE 59801811 D1 20011122; DK 1032474 T3 20011119; EP 1032474 A1 20000906; EP 1032474 B1 20011017; ES 2167953 T3 20020516; JP 2001523573 A 20011127; JP 4439726 B2 20100324; PT 1032474 E 20020429; WO 9926733 A1 19990603

DOCDB simple family (application)

US 55517900 A 20000803; AT 98955544 T 19981105; CA 2310716 A 19981105; DE 59801811 T 19981105; DK 98955544 T 19981105; EP 9807082 W 19981105; EP 98955544 A 19981105; ES 98955544 T 19981105; JP 2000521926 A 19981105; PT 98955544 T 19981105