EP 1034510 A1 20000913 - METHOD FOR PRODUCING A SUPPORTING ELEMENT FOR AN INTEGRATED CIRCUIT MODULE FOR PLACEMENT IN CHIP CARDS
Title (en)
METHOD FOR PRODUCING A SUPPORTING ELEMENT FOR AN INTEGRATED CIRCUIT MODULE FOR PLACEMENT IN CHIP CARDS
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES TRÄGERELEMENTS FÜR EINEN IC-BAUSTEIN ZUM EINBAU IN CHIPKARTEN
Title (fr)
PROCEDE DE PRODUCTION D'UN ELEMENT DE SUPPORT POUR UN MODULE CIRCUIT INTEGRE A MONTER DANS UNE CARTE A PUCE
Publication
Application
Priority
- DE 9903150 W 19990930
- DE 19845665 A 19981005
Abstract (en)
[origin: DE19845665A1] The invention relates to a method for producing a supporting element (4) for an integrated circuit module (7) for placement in chip cards (1), whereby the supporting element (4) comprises conductive contact surfaces (5) situated on an electrically insulating plastic substrate (10). Said contact surfaces are connected in a conductive manner to corresponding connecting points (8) of the integrated circuit module (7). In a first step, a plastic substrate (10) is provided with recesses (11) which correspond to the connecting points (8) of the integrated circuit module (7). In a second step, the integrated circuit module (7) is fixed with the side thereof comprising the connecting points (8) on the plastic substrate (10) in such a way that the connecting points (8) are arranged (10) in a positionally accurate manner with regard to the recesses (11) in the plastic substrate (10). In a third step, the electrically conductive contact surfaces (5) are produced via the recesses (11) in the plastic substrate (10) while forming electrically conductive connections (20) to the connecting points (8) of the integrated circuit module (7). This is achieved, while using a diffusion mask (12) and by depositing a metal (19) from the gas phase or by applying a conductive paste/liquid onto the regions (13) of the plastic substrate (10) which are not covered by the diffusion mask (12).
IPC 1-7
IPC 8 full level
B42D 15/10 (2006.01); G06K 19/077 (2006.01); H01L 21/60 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H05K 3/00 (2006.01); H05K 3/08 (2006.01); H05K 3/14 (2006.01); H05K 3/32 (2006.01)
CPC (source: EP)
G06K 19/07745 (2013.01); H01L 23/49855 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H05K 3/32 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/20 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19043 (2013.01)
Citation (search report)
See references of WO 0021027A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19845665 A1 20000420; DE 19845665 C2 20000817; AU 1262400 A 20000426; EP 1034510 A1 20000913; JP 2002526869 A 20020820; WO 0021027 A1 20000413
DOCDB simple family (application)
DE 19845665 A 19981005; AU 1262400 A 19990930; DE 9903150 W 19990930; EP 99955820 A 19990930; JP 2000575078 A 19990930