Global Patent Index - EP 1036221 A1

EP 1036221 A1 2000-09-20 - ELECTROPLATING FORMULATION AND PROCESS FOR PLATING IRON DIRECTLY ONTO ALUMINUM OR ALUMINUM ALLOYS

Title (en)

ELECTROPLATING FORMULATION AND PROCESS FOR PLATING IRON DIRECTLY ONTO ALUMINUM OR ALUMINUM ALLOYS

Title (de)

ELEKTOPLATTIERUNGSFORMULIERUNG UND PROZESS ZUR PLATTIERUNG VON EISEN DIREKT AUF ALUMINIUM ODER ALUMINIUM-LEGIERUNGEN

Title (fr)

FORMULATION D'ELECTROPLACAGE ET PROCEDE DE DEPOT DE FER PAR ELECTROPLACAGE DIRECTEMENT SUR DE L'ALUMINIUM OU D'ALLIAGES D'ALUMINIUM

Publication

EP 1036221 A1 (EN)

Application

EP 99905554 A

Priority

  • US 9901999 W
  • US 3347698 A

Abstract (en)

[origin: WO9945178A1] An electroplating formulation and process that employs an iron plating/activating bath which acts as both a chemical activation bath to activate the aluminum or aluminum alloy substrate and acts as an electroplating bath for depositing a hard iron layer directly onto the aluminum or aluminum alloy substrate. No separate activation bath, no transitory layers, and no separate undercoating layers are needed. The activation/electroplating bath solution includes the following: (1) Fe<+2> having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe<+2> ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe<+2> to Fe<+3>; (4) Cl<-> in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; and (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface. The surface of the aluminum or aluminum alloy substrate cathode is activated by immersing the cathode in the solution. An anode is also immersed in the solution. The iron layer is electroplated directly onto the activated aluminum or aluminum alloy surface of the cathode in the bath solution.

IPC 1-7 (main, further and additional classification)

C25D 3/20; C25D 5/30

IPC 8 full level (invention and additional information)

C25D 3/20 (2006.01); C25D 5/30 (2006.01)

CPC (invention and additional information)

C25D 5/42 (2013.01); C25D 3/20 (2013.01)

Citation (search report)

See references of WO 9945178A1

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

WO 9945178 A1 19990910; DE 69900538 D1 20020117; DE 69900538 T2 20020529; EP 1036221 A1 20000920; EP 1036221 B1 20011205

INPADOC legal status


2005-02-01 [PG25 IT] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: IT

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20050201

2003-09-24 [GBPC] GB: EUROPEAN PATENT CEASED THROUGH NON-PAYMENT OF RENEWAL FEE

2003-02-01 [PG25 GB] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: GB

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20030201

2002-12-06 [REG FR ST] NOTIFICATION OF LAPSE

2002-11-27 [26N] NO OPPOSITION FILED

2002-10-31 [PG25 FR] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: FR

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20021031

2002-09-03 [PG25 DE] LAPSED IN A CONTRACTING STATE ANNOUNCED VIA POSTGRANT INFORM. FROM NAT. OFFICE TO EPO

- Ref Country Code: DE

- Free text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

- Effective date: 20020903

2002-03-08 [ET] FR: TRANSLATION FILED

2002-01-17 [REF] CORRESPONDS TO:

- Document: DE 69900538 20020117

2002-01-01 [REG GB IF02] EUROPEAN PATENT IN FORCE AS OF 2002-01-01

2001-12-05 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: B1

- Designated State(s): DE FR GB IT

2000-12-20 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20001103

2000-09-20 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000530

2000-09-20 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): DE FR GB IT