EP 1036221 B1 20011205 - ELECTROPLATING FORMULATION AND PROCESS FOR PLATING IRON DIRECTLY ONTO ALUMINUM OR ALUMINUM ALLOYS
Title (en)
ELECTROPLATING FORMULATION AND PROCESS FOR PLATING IRON DIRECTLY ONTO ALUMINUM OR ALUMINUM ALLOYS
Title (de)
ELEKTOPLATTIERUNGSFORMULIERUNG UND PROZESS ZUR PLATTIERUNG VON EISEN DIREKT AUF ALUMINIUM ODER ALUMINIUM-LEGIERUNGEN
Title (fr)
FORMULATION D'ELECTROPLACAGE ET PROCEDE DE DEPOT DE FER PAR ELECTROPLACAGE DIRECTEMENT SUR DE L'ALUMINIUM OU D'ALLIAGES D'ALUMINIUM
Publication
Application
Priority
- US 9901999 W 19990201
- US 3347698 A 19980302
Abstract (en)
[origin: WO9945178A1] An electroplating formulation and process that employs an iron plating/activating bath which acts as both a chemical activation bath to activate the aluminum or aluminum alloy substrate and acts as an electroplating bath for depositing a hard iron layer directly onto the aluminum or aluminum alloy substrate. No separate activation bath, no transitory layers, and no separate undercoating layers are needed. The activation/electroplating bath solution includes the following: (1) Fe<+2> having a concentration ranging from about 0.65 to about 2.5 moles per liter of solution; (2) at least one anion associated with the Fe<+2> ion; (3) a reducing agent in an amount sufficient to prevent oxidation of Fe<+2> to Fe<+3>; (4) Cl<-> in an amount sufficient to promote dissolution of the anode and increase the conductivity of the solution; and (5) a wetting agent in an amount sufficient to prevent pitting of the aluminum electroplated surface. The surface of the aluminum or aluminum alloy substrate cathode is activated by immersing the cathode in the solution. An anode is also immersed in the solution. The iron layer is electroplated directly onto the activated aluminum or aluminum alloy surface of the cathode in the bath solution.
IPC 1-7
IPC 8 full level
CPC (source: EP)
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9945178 A1 19990910; DE 69900538 D1 20020117; DE 69900538 T2 20020529; EP 1036221 A1 20000920; EP 1036221 B1 20011205
DOCDB simple family (application)
US 9901999 W 19990201; DE 69900538 T 19990201; EP 99905554 A 19990201