Global Patent Index - EP 1036416 A1

EP 1036416 A1 2000-09-20 - ELECTRONIC HYBRID COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

Title (en)

ELECTRONIC HYBRID COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

Title (de)

ELEKTRONISCHES HYBRID-BAUELEMENT UND VERFAHREN ZU SEINER HERSTELLUNG

Title (fr)

COMPOSANT ELECTRONIQUE HYBRIDE ET PROCEDE PERMETTANT DE LE PRODUIRE

Publication

EP 1036416 A1 (DE)

Application

EP 97954329 A

Priority

  • DE 9702812 W
  • DE 19720300 A

Abstract (en)

[origin: DE19720300A1] A hybrid electronic component, with a chip-on-chip arrangement, has a carrier substrate with a cavity provided with an insulating layer and an overlying metal layer, an implanted chip being electrically contacted by the metal layer in the cavity. Preferably, the top of the implanted chip is coplanar with the substrate surface, and the metal layer is a multilayer having an oxidation resistant upper metal layer. The carrier substrate is preferably an optical pin diode array with diode areas grouped around an implanted LED (2), the upper edge of the LED preferably lying a few microns below the plane of the diode areas. Also claimed is a method of producing the above component by: (a) anisotropically etching a recess in the carrier substrate; and (b) structuring to produce conductive connections between the recess and conductor line structures on the planar face by means of a multiple metallisation system.

IPC 1-7 (main, further and additional classification)

H01L 25/18; H01L 25/16; H01L 29/06

IPC 8 full level (invention and additional information)

H01L 25/16 (2006.01); H01L 25/18 (2006.01); H01L 29/06 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01)

CPC (invention and additional information)

H01L 29/0657 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01039 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15165 (2013.01)

Combination set (CPC)

  1. H01L 2924/0002 + H01L 2924/00
  2. H01L 2224/48091 + H01L 2924/00014

Citation (search report)

See references of WO 9928971A1

Designated contracting state (EPC)

AT CH DE FR GB LI

EPO simple patent family

DE 19720300 A1 19971204; DE 19720300 B4 20060504; EP 1036416 A1 20000920; WO 9928971 A1 19990610

INPADOC legal status


2011-05-04 [18W] WITHDRAWN

- Ref Legal Event Code: 18W

- Effective date: 20110329

2004-11-24 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20041006

2001-05-09 [RAP1] TRANSFER OF RIGHTS OF AN EP PUBLISHED APPLICATION

- Owner name: CIS INSTITUT FUER MIKROSENSORIK GGMBH

- Ref Legal Event Code: RAP1

2000-09-20 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000621

2000-09-20 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT CH DE FR GB LI