Global Patent Index - EP 1036419 A1

EP 1036419 A1 20000920 - METHOD FOR MOUNTING EXTERNAL ELECTRODES ON SEMICONDUCTOR ACTUATORS

Title (en)

METHOD FOR MOUNTING EXTERNAL ELECTRODES ON SEMICONDUCTOR ACTUATORS

Title (de)

VERFAHREN ZUR ANBRINGUNG VON AUSSENELEKTRODEN AN FESTKÖRPERAKTOREN

Title (fr)

PROCEDE D'APPLICATION D'ELECTRODES EXTERIEURES SUR DES ACTIONNEURS A SEMI-CONDUCTEUR

Publication

EP 1036419 A1 20000920 (DE)

Application

EP 98965233 A 19981204

Priority

  • DE 19753930 A 19971205
  • EP 9807899 W 19981204

Abstract (en)

[origin: DE19753930A1] The invention relates to a method for mounting external electrodes (5) on stacked semiconductor actuators (1) consisting of a plurality of thin layers of electromechanically active material with internal metal electrodes (14) which are placed in between and are alternately brought out or insulated. The internal electrodes which protrude above a metallic base coating (2) are electrically connected in parallel and are linked to an external electrode (5). In order to extend the field of application and to increase service life, a three-dimensional electrically conductive structure is used as an external electrode (5). Said structure can be extended in the direction of the actuator axis and the external electrode (5) is pressed against the metallic base coating in order to produce an electrical contact.

IPC 1-7

H01L 41/083; H01L 41/22

IPC 8 full level

H01L 41/083 (2006.01); H01L 41/23 (2013.01); H01L 41/29 (2013.01); H01L 41/293 (2013.01); H02N 2/04 (2006.01)

CPC (source: EP)

H10N 30/02 (2023.02); H10N 30/063 (2023.02); H10N 30/50 (2023.02); H10N 30/503 (2023.02); H10N 30/872 (2023.02); H10N 30/875 (2023.02); H10N 30/877 (2023.02)

Citation (search report)

See references of WO 9930374A1

Designated contracting state (EPC)

CH DE FR GB IT LI

DOCDB simple family (publication)

DE 19753930 A1 19990610; EP 1036419 A1 20000920; JP 2001526465 A 20011218; WO 9930374 A1 19990617

DOCDB simple family (application)

DE 19753930 A 19971205; EP 9807899 W 19981204; EP 98965233 A 19981204; JP 2000524828 A 19981204