Global Patent Index - EP 1038312 A1

EP 1038312 A1 2000-09-27 - ASSEMBLY FOR AND METHOD OF PACKAGING INTEGRATED DISPLAY DEVICES

Title (en)

ASSEMBLY FOR AND METHOD OF PACKAGING INTEGRATED DISPLAY DEVICES

Title (de)

VERFAHREN UND VORRICHTUNG ZUM BEHAUSEN INTEGRIERTER ANZEIGEN

Title (fr)

ENSEMBLE ET PROCEDE DE CONDITIONNEMENT DE DISPOSITIFS DE VISUALISATION INTEGREE

Publication

EP 1038312 A1 (EN)

Application

EP 98966131 A

Priority

  • US 9827884 W
  • US 7065698 P

Abstract (en)

[origin: WO9935681A1] A packaging assembly for compactly sealing a display chip device is disclosed. The packaging assembly includes at least a first cover member and a seal assembly for sealing the display chip device within an enclosure. A method of packaging a display chip device is also disclosed.

IPC 1-7 (main, further and additional classification)

H01L 21/44; H01L 21/48; H01L 21/50

IPC 8 full level (invention and additional information)

H01L 23/26 (2006.01); H01L 27/15 (2006.01); H01L 51/52 (2006.01)

CPC (invention and additional information)

H01L 27/156 (2013.01); H01L 23/26 (2013.01); H01L 51/5243 (2013.01); H01L 51/5246 (2013.01); H01L 51/525 (2013.01); H01L 51/5253 (2013.01); H01L 51/5259 (2013.01); H01L 51/529 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01)

Citation (search report)

See references of WO 9935681A1

Designated contracting state (EPC)

AT BE CH DE ES FR GB IE IT LI SE

EPO simple patent family

WO 9935681 A1 19990715; EP 1038312 A1 20000927

INPADOC legal status


2004-02-18 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20030702

2000-09-27 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000405

2000-09-27 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE CH DE ES FR GB IE IT LI SE