Global Patent Index - EP 1038418 A1

EP 1038418 A1 20000927 - MANUFACTURING METHOD OF WIRING CIRCUIT BOARD, AND WIRING CIRCUIT BOARD

Title (en)

MANUFACTURING METHOD OF WIRING CIRCUIT BOARD, AND WIRING CIRCUIT BOARD

Title (de)

VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE SOWIE ERHALTENDE LEITERPLATTE

Title (fr)

PROCEDE DE FABRICATION DE CARTE A CIRCUIT IMPRIME, ET CARTE AINSI OBTENUE

Publication

EP 1038418 A1 20000927 (EN)

Application

EP 99970262 A 19991007

Priority

  • JP 9905531 W 19991007
  • JP 28524698 A 19981007

Abstract (en)

[origin: WO0021345A1] Fine lines of line width of 40 mu m or less are obtained stably without defect on a ceramic substrate, and hence a circuit board of high density and high precision is obtained. The method comprises the steps of: (a) fabricating a ceramic substrate (2), (b) polishing the surface (28) of the ceramic substrate (2) to surface roughness Ra of 0.5 mu m or less, (c) forming a photosensitive conductor layer (3a) on the surface of the ceramic substrate (2a), and (d) processing the photosensitive conductor layer (3a) by photolithography, and forming a specified wiring pattern (38). Herein, supposing the roughness curve to be Y = f (x), the extracting length of the roughness curve in the center line direction to be L, the central axis of the extracting portion to be X-axis, and the direction vertical to the X-axis to be Y-axis, Ra is the value calculated in the formula (I).

IPC 1-7

H05K 3/02; H01L 21/48

IPC 8 full level

H01L 21/48 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01)

CPC (source: EP KR)

H01L 21/4846 (2013.01 - EP); H05K 3/02 (2013.01 - EP KR)

Citation (search report)

See references of WO 0021345A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 0021345 A1 20000413; CN 1287771 A 20010314; EP 1038418 A1 20000927; ID 24661 A 20000727; JP 2000114691 A 20000421; KR 20010032727 A 20010425; TW 443082 B 20010623

DOCDB simple family (application)

JP 9905531 W 19991007; CN 99801769 A 19991007; EP 99970262 A 19991007; ID 20001076 A 19991007; JP 28524698 A 19981007; KR 20007006016 A 20000602; TW 88116532 A 19990927