EP 1038419 A1 20000927 - MANUFACTURING METHOD OF CIRCUIT BOARD, MANUFACTURING APPARATUS FOR IT, AND POROUS SHEET USED IN IT
Title (en)
MANUFACTURING METHOD OF CIRCUIT BOARD, MANUFACTURING APPARATUS FOR IT, AND POROUS SHEET USED IN IT
Title (de)
VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE VORRICHTUNG DAZU UND DARIN VERWENDETE PORÖSE FOLIE
Title (fr)
PROCEDE DE FABRICATION DE CARTE A CIRCUIT, APPAREIL DE FABRICATION PREVU A CET EFFET ET FEUILLE POREUSE UTILISEE DANS CE PROCEDE
Publication
Application
Priority
- JP 9905530 W 19991007
- JP 28519598 A 19981007
Abstract (en)
[origin: US6598292B1] A manufacturing method of a circuit board comprises the steps of: (a) feeding a printing stage having a porous member comprising a porous plate and a porous sheet, the porous sheet is composed of 90 wt % to 98 wt % of cellulose; (b) placing a plate for the circuit board having a pierced hole above the porous member; and (c) filling a conductive material in the pierced hole from an upper side of the plate for circuit board by sucking the porous member at a prescribed vacuum pressure from a back of the porous member.
IPC 1-7
IPC 8 full level
B41F 15/20 (2006.01); D21H 11/04 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01)
CPC (source: EP KR US)
B41F 15/20 (2013.01 - EP US); H05K 3/40 (2013.01 - KR); H05K 3/4053 (2013.01 - EP US); H05K 3/4061 (2013.01 - EP US); B41P 2215/134 (2013.01 - EP US); H05K 3/1216 (2013.01 - EP US); H05K 2201/0116 (2013.01 - EP US); H05K 2201/0284 (2013.01 - EP US); H05K 2203/0152 (2013.01 - EP US); H05K 2203/0156 (2013.01 - EP US); H05K 2203/082 (2013.01 - EP US); Y10T 29/49117 (2015.01 - EP US); Y10T 29/49155 (2015.01 - EP US); Y10T 29/49165 (2015.01 - EP US)
Citation (search report)
See references of WO 0021347A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
US 6598292 B1 20030729; AT E322806 T1 20060415; CN 1277797 A 20001220; CN 1310578 C 20070411; DE 69930719 D1 20060518; DE 69930719 T2 20060824; EP 1038419 A1 20000927; EP 1038419 B1 20060405; ID 24274 A 20000713; JP 2000114716 A 20000421; JP 3405685 B2 20030512; KR 100382191 B1 20030426; KR 20010024637 A 20010326; TW 587411 B 20040511; WO 0021347 A1 20000413
DOCDB simple family (application)
US 55439500 A 20000713; AT 99970264 T 19991007; CN 99801583 A 19991007; DE 69930719 T 19991007; EP 99970264 A 19991007; ID 20000916 A 19991007; JP 28519598 A 19981007; JP 9905530 W 19991007; KR 20007005284 A 20000515; TW 88116734 A 19990929