Global Patent Index - EP 1039058 B1

EP 1039058 B1 20041208 - Process to manufacture a thermal insulation compound system using an adhesive paste or filler

Title (en)

Process to manufacture a thermal insulation compound system using an adhesive paste or filler

Title (de)

Verfahren zur Herstellung von Wärmedämmverbundsystemen mit Hilfe einer organischen Klebe- bzw. Spachtelmasse

Title (fr)

Procédé pour fabriquer un système composite pour isolation thermique en utilisant une pâte adhésive ou un mastic

Publication

EP 1039058 B1 20041208 (DE)

Application

EP 00106349 A 20000323

Priority

DE 19913315 A 19990324

Abstract (en)

[origin: EP1039058A1] The adhesive or filler is foamed prior to application to the insulation board and/or facade surface. The organic material is used as an adhesive to secure insulation boards to a building facade, as a filler to even out any facade surface irregularities prior to securing the insulation boards and/or to provide the mounted insulation boards with a reinforcing layer.

IPC 1-7

E04B 1/76; E04F 13/08

IPC 8 full level

E04B 1/76 (2006.01); E04F 13/08 (2006.01)

CPC (source: EP US)

E04B 1/762 (2013.01 - EP US); Y10T 428/249982 (2015.04 - EP US)

Citation (examination)

US 3765972 A 19731016 - WESP G

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1039058 A1 20000927; EP 1039058 B1 20041208; AT E284469 T1 20041215; CA 2302932 A1 20000924; DE 19913315 A1 20000928; DE 50008877 D1 20050113; PL 200845 B1 20090227; PL 339161 A1 20000925; US 2002120021 A1 20020829; US 6528551 B2 20030304

DOCDB simple family (application)

EP 00106349 A 20000323; AT 00106349 T 20000323; CA 2302932 A 20000323; DE 19913315 A 19990324; DE 50008877 T 20000323; PL 33916100 A 20000322; US 53392100 A 20000323