EP 1039977 A1 20001004 - A METHOD FOR REMOVING SURFACE CONTAMINANTS ON MOULDS USED IN SEMICONDUCTOR PACKAGING TOOLS
Title (en)
A METHOD FOR REMOVING SURFACE CONTAMINANTS ON MOULDS USED IN SEMICONDUCTOR PACKAGING TOOLS
Title (de)
VERFAHREN ZUM ENTFERNEN VON OBERFLÄCHENVERUNREINIGUNGEN VON IN HALBLEITERVERPACKUNGSWERKZEUGEN VERWENDETEN FORMEN
Title (fr)
PROCEDE PERMETTANT D'ELIMINER LES CONTAMINANTS DE SURFACE DE MOULES UTILISES SUR DES OUTILS D'ENCAPSULATION DE SEMICONDUCTEURS
Publication
Application
Priority
- SG 9800058 W 19980706
- SG 1997004544 A 19971218
Abstract (en)
[origin: WO9930845A1] The present invention utilizes laser to remove the surface contaminants such as grease, wax, and resin residue from a mould used in semiconductor packaging tools. The contaminant removal process utilizing the laser involves shooting a beam of laser onto the surface of the mould having the contaminants. The laser is delivered as a pulse which lasts only a short duration. Multiple pulses may be required to completely remove the contaminants. Because the area of coverage for each pulse is usually much smaller than the total area of the mould surface, the laser needs to be moved around until the entire mould surface has been exposed to the laser. Because fumes are produced as the laser disintegrates the contaminants, some type of vacuum should be used to remove the residual gas and other debris.
IPC 1-7
IPC 8 full level
B08B 7/00 (2006.01); B29C 33/72 (2006.01)
CPC (source: EP)
B08B 7/0042 (2013.01)
Designated contracting state (EPC)
DE GB NL
DOCDB simple family (publication)
WO 9930845 A1 19990624; CN 1210113 C 20050713; CN 1282277 A 20010131; EP 1039977 A1 20001004; EP 1039977 A4 20030813; JP 2002508249 A 20020319; MY 136708 A 20081128; SG 78282 A1 20010220; TW 480689 B 20020321
DOCDB simple family (application)
SG 9800058 W 19980706; CN 98812286 A 19980706; EP 98936795 A 19980706; JP 2000538813 A 19980706; MY PI9802099 A 19980508; SG 1997004544 A 19971218; TW 87106779 A 19980501