EP 1040515 A1 20001004 - METHOD FOR FORMING A UNIFORM NETWORK OF SEMICONDUCTOR ISLANDS ON AN INSULATING SUBSTRATE
Title (en)
METHOD FOR FORMING A UNIFORM NETWORK OF SEMICONDUCTOR ISLANDS ON AN INSULATING SUBSTRATE
Title (de)
VERFAHREN ZUR HERSTELLUNG EINES NETZES AUS REGELMÄSSIG GEORDNETEN HALBLEITER-INSELN AUF EINEM ISOLIERENDEN SUBSTRAT
Title (fr)
PROCEDE DE FORMATION D'UN RESEAU REGULIER D'ILOTS SEMI-CONDUCTEURS SUR UN SUBSTRAT ISOLANT
Publication
Application
Priority
- FR 9802769 W 19981217
- FR 9716158 A 19971219
Abstract (en)
[origin: FR2772984A1] An array of semiconductor material islands (124) is formed on uniformly distributed nucleation seeds (122, 122a) deposited on an insulating material (112) using a distribution layer (116) of material having a regular molecular structure. Independent claims are also included for the following: (i) production of a quantum structure of Coulomb blocking type having an array of semiconductor islands formed by the above process; and (ii) a Coulomb blocking type electronic device having electron sources separated by a collection of nano-size semiconductor islands regularly spaced on an insulating substrate.
IPC 1-7
IPC 8 full level
H01L 29/06 (2006.01); H01L 21/20 (2006.01); H01L 21/205 (2006.01); H01L 29/66 (2006.01); H01L 51/05 (2006.01)
CPC (source: EP US)
B82Y 10/00 (2013.01 - EP US); B82Y 30/00 (2013.01 - EP US); H01L 21/02381 (2013.01 - EP US); H01L 21/0242 (2013.01 - EP US); H01L 21/02422 (2013.01 - EP US); H01L 21/02488 (2013.01 - EP US); H01L 21/02532 (2013.01 - EP US); H01L 21/0262 (2013.01 - EP US); H01L 21/02645 (2013.01 - EP US); H01L 21/02647 (2013.01 - EP US)
Citation (search report)
See references of WO 9933099A1
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
FR 2772984 A1 19990625; FR 2772984 B1 20030725; EP 1040515 A1 20001004; JP 2001527289 A 20011225; US 6365491 B1 20020402; WO 9933099 A1 19990701
DOCDB simple family (application)
FR 9716158 A 19971219; EP 98962497 A 19981217; FR 9802769 W 19981217; JP 2000525915 A 19981217; US 55427700 A 20000606