Global Patent Index - EP 1040519 A1

EP 1040519 A1 20001004 - PLASTIC COMPOSITE BODY

Title (en)

PLASTIC COMPOSITE BODY

Title (de)

KUNSTSTOFFVERBUNDKÖRPER

Title (fr)

CORPS COMPOSITE EN MATIERE PLASTIQUE

Publication

EP 1040519 A1 20001004 (DE)

Application

EP 98965611 A 19981214

Priority

  • DE 9803661 W 19981214
  • DE 19756887 A 19971219

Abstract (en)

[origin: DE19756887A1] An integrated circuit has a lead frame to which a chip made of a semiconductor material is secured by an adhesive layer. The adhesive layer contains at least one filler and one plastic material. The filler comprises nanoscale, in particular spherical particles produced by a condensation process and which can be conductive or insulating. It is also possible to provide the chip with a plastic sheath that contains such fillers.

IPC 1-7

H01L 23/29; H01L 23/495

IPC 8 full level

C08L 101/00 (2006.01); C08J 5/12 (2006.01); C08K 3/00 (2006.01); C08K 3/01 (2018.01); H01L 21/52 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01)

CPC (source: EP US)

C08J 5/124 (2013.01 - EP); C08K 3/01 (2018.01 - EP); H01L 23/295 (2013.01 - EP); H01L 23/49513 (2013.01 - EP); H01L 2924/0002 (2013.01 - EP); Y10S 977/779 (2013.01 - EP); Y10S 977/893 (2013.01 - EP); Y10T 428/31678 (2015.04 - EP US)

C-Set (source: EP)

H01L 2924/0002 + H01L 2924/00

Citation (search report)

See references of WO 9933106A1

Designated contracting state (EPC)

DE FR GB IT

DOCDB simple family (publication)

DE 19756887 A1 19990701; EP 1040519 A1 20001004; JP 2001527131 A 20011225; US 6469086 B1 20021022; WO 9933106 A1 19990701

DOCDB simple family (application)

DE 19756887 A 19971219; DE 9803661 W 19981214; EP 98965611 A 19981214; JP 2000525922 A 19981214; US 59642300 A 20000619