EP 1044289 A2 20001018 - PLASMA BORONIZING
Title (en)
PLASMA BORONIZING
Title (de)
PLASMABORIERUNG
Title (fr)
BORURATION AU PLASMA
Publication
Application
Priority
- DE 19755595 A 19971215
- EP 9808079 W 19981211
Abstract (en)
[origin: WO9931291A2] The invention relates to a method for producing a boride layer on a surface by means of plasma boronizing in which a gas medium containing a boron dispenser medium is fed to a reactor (10), and a glow discharge is generated in said reactor (10). The invention also relates to a device which is especially suited for carrying out said method. Known methods for plasma boronizing of, for example, metallic surfaces are disadvantageous in that they do not lead to non-porous boride layers and are thus not suited for industrial series applications. According to the inventive method, the parameters of the production of the plasma produced in a treatment chamber (11) of the reactor (10) have to be selected such that an increased portion of excited boron particles is obtained in the plasma. Non-porous boride layers are acquired in this manner. The inventive method is suited, for example, for coatings of components which need to have a surface that is highly resistant to wear, as the components are subjected to an increased demand, for example, gears, camshafts and the like. Method parameters with which the production of the boride layer can be influenced are, for example, tension, pulse-duty factor, frequency, temperature, pressure during the production of the plasma and the content of boron dispensing medium, and the remaining components in the gas medium which is fed to the reactor (10).
IPC 1-7
IPC 8 full level
C23C 8/08 (2006.01); C23C 8/36 (2006.01); C23C 8/38 (2006.01); C23C 16/00 (2006.01)
CPC (source: EP KR US)
C23C 8/08 (2013.01 - KR); C23C 8/36 (2013.01 - EP KR US); C23C 8/38 (2013.01 - EP US)
Designated contracting state (EPC)
AT DE ES FR GB IT PT SE
DOCDB simple family (publication)
WO 9931291 A2 19990624; WO 9931291 A3 19990910; AT E215132 T1 20020415; CN 1198953 C 20050427; CN 1282383 A 20010131; DE 59803574 D1 20020502; EP 1044289 A2 20001018; EP 1044289 B1 20020327; EP 1143031 A2 20011010; EP 1143031 A3 20040428; JP 2002508448 A 20020319; JP 4588213 B2 20101124; KR 100583262 B1 20060525; KR 20010033075 A 20010425; US 6783794 B1 20040831
DOCDB simple family (application)
EP 9808079 W 19981211; AT 98965249 T 19981211; CN 98812183 A 19981211; DE 59803574 T 19981211; EP 01110904 A 19981211; EP 98965249 A 19981211; JP 2000539186 A 19981211; KR 20007006436 A 20000613; US 59490500 A 20000615