Global Patent Index - EP 1046602 B1

EP 1046602 B1 20040602 - Method for the preparation of a splice

Title (en)

Method for the preparation of a splice

Title (de)

Verfahren zur Splice-Vorbereitung

Title (fr)

Procédé de préparation d'une épissure

Publication

EP 1046602 B1 20040602 (DE)

Application

EP 00106378 A 20000324

Priority

DE 19918220 A 19990422

Abstract (en)

[origin: EP1046602A2] The method for pre-preparing a splice comprises applying a pressure roller (3) to a bale (1) and cutting it across so that t cut ends (6) of the web hang down on either side of the pressure roller. A splice of double-sided adhesive tape(12) is applied t the end of the web (11) on the bale. The cover strip is removed from the top of the tape and the hanging end of the cut web is rolled around the bale and stuck to it

IPC 1-7

B65H 19/18; B65H 19/10

IPC 8 full level

B65H 19/10 (2006.01); B65H 19/18 (2006.01)

CPC (source: EP US)

B65H 19/102 (2013.01 - EP US); B65H 2301/4607 (2013.01 - EP US); B65H 2301/46078 (2013.01 - EP US); Y10T 156/1062 (2015.01 - EP US); Y10T 156/108 (2015.01 - EP US)

Designated contracting state (EPC)

DE ES FR GB IT

DOCDB simple family (publication)

EP 1046602 A2 20001025; EP 1046602 A3 20020626; EP 1046602 B1 20040602; CA 2303706 A1 20001022; CA 2303706 C 20071009; DE 19918220 A1 20001102; DE 19918220 C2 20021024; DE 50006651 D1 20040708; ES 2220282 T3 20041216; JP 2000327184 A 20001128; US 6582547 B1 20030624

DOCDB simple family (application)

EP 00106378 A 20000324; CA 2303706 A 20000404; DE 19918220 A 19990422; DE 50006651 T 20000324; ES 00106378 T 20000324; JP 2000107947 A 20000410; US 55092200 A 20000417