EP 1047649 A1 20001102 - METHOD FOR PRODUCING COMPOSITE MATERIALS AND EXAMPLES OF SUCH COMPOSITE MATERIALS
Title (en)
METHOD FOR PRODUCING COMPOSITE MATERIALS AND EXAMPLES OF SUCH COMPOSITE MATERIALS
Title (de)
VERFAHREN ZUR HERSTELLUNG VON KOMPOSITWERKSTOFFEN UND VERTRETER SOLCHER KOMPOSITWERKSTOFFE
Title (fr)
PROCEDE DE PRODUCTION DE MATERIAUX COMPOSITES, ET EXEMPLES DE TELS MATERIAUX COMPOSITES
Publication
Application
Priority
- DE 9903155 W 19991001
- DE 19845532 A 19981002
Abstract (en)
[origin: DE19845532A1] The aim of the invention is to economically produce composite materials which contain silicon nitride and metal silicide and which comprise determined electrical properties while using few pieces of equipment. According to the invention, it should be possible to produce shaped bodies with close to final contours from the composite materials before sintering and to provide examples of such composite materials. To these ends, the invention provides a method in which a starting material containing Si3N4 and metal silicide is subjected to gas pressure sintering in an atmosphere containing nitrogen. In addition, Me5Si3 is introduced as metal silicide into the starting material. The nitrogen partial pressure is determined according to the sintering temperature such that Si3N4 remains stabile at the lower limit of the applicable area and Me5Si3 remains stabile at the upper limit. The invention also provides a composite material which contains silicon and whose silicon-containing constituents are comprised of Si3N4 and of a metal silicide, whereby the metal silicide is selected from the group Nb5Si3, V5Si3, Ta5Si3 and W5Si3.
IPC 1-7
IPC 8 full level
C04B 35/58 (2006.01); C04B 35/584 (2006.01); C04B 35/593 (2006.01)
CPC (source: EP US)
C04B 35/58092 (2013.01 - EP US); C04B 35/5935 (2013.01 - EP US); C04B 35/645 (2013.01 - EP US)
Citation (search report)
See references of WO 0020352A1
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
DE 19845532 A1 20000406; EP 1047649 A1 20001102; JP 2002526374 A 20020820; JP 4755342 B2 20110824; US 6737015 B1 20040518; WO 0020352 A1 20000413
DOCDB simple family (application)
DE 19845532 A 19981002; DE 9903155 W 19991001; EP 99955824 A 19991001; JP 2000574474 A 19991001; US 55577700 A 20001101