Global patent index - EP 1048075 A1

EP 1048075 A1 2000-11-02 - SEMICONDUCTOR COMPONENT WITH SEVERAL SUBSTRATE LAYERS AND AT LEAST ONE SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT

Title (en)

SEMICONDUCTOR COMPONENT WITH SEVERAL SUBSTRATE LAYERS AND AT LEAST ONE SEMICONDUCTOR CHIP AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT

Title (de)

HALBLEITERBAUELEMENT MIT MEHREREN SUBSTRATLAGEN UND ZUMINDEST EINEM HALBLEITERCHIP UND EINEM VERFAHREN ZUM HERSTELLEN EINES SOLCHEN HALBLEITERBAUELEMENTES

Title (fr)

COMPOSANT A SEMI-CONDUCTEUR COMPORTANT PLUSIEURS COUCHES DE SUBSTRATS ET AU MOINS UNE PUCE DE SEMI-CONDUCTEUR, ET PROCEDE DE PRODUCTION D'UN TEL COMPOSANT A SEMI-CONDUCTEUR

Publication

EP 1048075 A1 (DE)

Application

EP 99906052 A

Priority

  • DE 9900069 W
  • DE 19801312 A

Abstract (en)

[origin: DE19801312A1] The semiconductor element has several stacked substrate layers (2,3,2a,3a,2c) and several semiconductor chips (1) with flip-chip contacts (12) and contact pads (7) connected to the element contacts (17) via conductor paths (4). The substrate layers are selectively provided with openings (14) for locating the semiconductor chips and the conductor paths for connecting the chips to the element contacts, each extending from the chip to the edge of the substrate layer.

IPC 1-7 (main, further and additional classification)

H01L 25/065

IPC 8 full level (invention and additional information)

H01R 12/16 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 25/11 (2006.01); H01L 25/18 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01)

CPC (invention and additional information)

H01L 25/0657 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/1627 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H05K 1/144 (2013.01); H05K 3/3431 (2013.01); H05K 3/366 (2013.01)

Combination set (CPC)

  1. H01L 2224/48091 + H01L 2924/00014
  2. H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  3. H01L 2924/15311 + H01L 2224/73204 + H01L 2224/16225 + H01L 2224/32225 + H01L 2924/00
  4. H01L 2924/07811 + H01L 2924/00
  5. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  6. H01L 2924/15311 + H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  7. H01L 2924/181 + H01L 2924/00012

Citation (search report)

See references of WO 9936962A1

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

DE 19801312 A1 19990722; EP 1048075 A1 20001102; JP 2002510148 A 20020402; US 6380616 B1 20020430; WO 9936962 A1 19990722

INPADOC legal status

2009-02-11 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20080821

2006-11-15 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20050511

2005-06-29 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20050511

2000-11-02 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000628

2000-11-02 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): DE FR GB IT