EP 1049167 A2 20001102 - Semiconductor device and manufacturing method thereof
Title (en)
Semiconductor device and manufacturing method thereof
Title (de)
Halbleiterbauelement und dessen Herstellungsverfahren
Title (fr)
Dispositif à semi-conducteur et son procédé de fabrication
Publication
Application
Priority
- JP 12492499 A 19990430
- JP 20696199 A 19990722
Abstract (en)
A semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. An LDD region 207 provided in an n-channel TFT 302 forming a driving circuit enhances the tolerance for hot carrier injection. LDD regions 217 - 220 provided in an n-channel TFT (pixel TFT) 304 forming a pixel portion greatly contribute to the decrease in the OFF current value. Here, the LDD region of the n-channel TFT of the driving circuit is formed such that the concentration of the n-type impurity element becomes higher as the distance from an adjoining drain region decreases.
IPC 1-7
IPC 8 full level
H01L 21/336 (2006.01); H01L 21/77 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); G02F 1/1362 (2006.01); H01L 27/32 (2006.01)
CPC (source: EP US)
H01L 21/02675 (2013.01 - US); H01L 21/3003 (2013.01 - EP US); H01L 27/1255 (2013.01 - EP US); H01L 29/42384 (2013.01 - EP US); H01L 29/4908 (2013.01 - EP US); H01L 29/66757 (2013.01 - EP US); H01L 29/78621 (2013.01 - EP US); G02F 1/13454 (2013.01 - EP US); H01L 21/02381 (2013.01 - EP US); H01L 21/0242 (2013.01 - EP US); H01L 21/02422 (2013.01 - EP US); H01L 21/02425 (2013.01 - EP US); H01L 21/02488 (2013.01 - EP US); H01L 21/02532 (2013.01 - EP US); H01L 21/02592 (2013.01 - EP US); H01L 21/02672 (2013.01 - EP US); H01L 21/02678 (2013.01 - EP US); H01L 21/02683 (2013.01 - EP US); H01L 21/02686 (2013.01 - EP US); H01L 29/78645 (2013.01 - EP US); H01L 2029/7863 (2013.01 - EP US); H10K 59/12 (2023.02 - EP US)
Citation (applicant)
- EP 1041641 A2 20001004 - SEMICONDUCTOR ENERGY LAB [JP]
- JP H10125929 A 19980515 - SEIKO EPSON CORP
- JP H0955508 A 19970225 - SANYO ELECTRIC CO
Designated contracting state (EPC)
DE FI FR GB NL
DOCDB simple family (publication)
EP 1049167 A2 20001102; EP 1049167 A3 20071024; EP 2256808 A2 20101201; JP 2009105410 A 20090514; JP 2009152615 A 20090709; JP 4387443 B2 20091216; JP 4637948 B2 20110223; US 2002163035 A1 20021107; US 2003129791 A1 20030710; US 2004214439 A1 20041028; US 2006121736 A1 20060608; US 2009212294 A1 20090827; US 2011089428 A1 20110421; US 2012097960 A1 20120426; US 6534826 B2 20030318; US 6753257 B2 20040622; US 7015141 B2 20060321; US 7573069 B2 20090811; US 7858987 B2 20101228; US 8097884 B2 20120117; US 8748898 B2 20140610
DOCDB simple family (application)
EP 00108989 A 20000427; EP 10009807 A 20000427; JP 2008274086 A 20081024; JP 2008332083 A 20081226; US 201113341012 A 20111230; US 32940502 A 20021227; US 33015206 A 20060112; US 42313609 A 20090414; US 55918500 A 20000427; US 85225804 A 20040525; US 97644710 A 20101222