EP 1051886 A2 20001115 - DEVICE FOR ELECTROLYTIC TREATMENT OF PRINTED CIRCUIT BOARDS AND CONDUCTIVE FILMS
Title (en)
DEVICE FOR ELECTROLYTIC TREATMENT OF PRINTED CIRCUIT BOARDS AND CONDUCTIVE FILMS
Title (de)
VORRICHTUNG ZUM ELEKTROLYTISCHEN BEHANDELN VON LEITERPLATTEN UND LEITERFOLIEN
Title (fr)
DISPOSITIF DE TRAITEMENT ELECTROLYTIQUE DE CARTE DE CIRCUITS ET DE FEUILLES CONDUCTRICES
Publication
Application
Priority
- DE 9801034 W 19980407
- DE 19717512 A 19970425
Abstract (en)
[origin: DE19717512A1] The invention relates to a device for electrolytic treatment of printed circuit boards (3). According to the invention, the printed circuit boards can be continuously guided through the inventive device in a plane of conveyance, in an essentially horizontal direction. The invention is characterised in that counter electrodes (1,2) are located on at least one side opposite and essentially parallel to the plane of conveyance, so that electrolyte chambers (4, 5) are formed between opposite counter electrodes or between the counter electrodes and the plane of conveyance, said counter electrodes each forming essentially continuous electrode surfaces. Guide elements (7, 8) for the printed circuit boards are located in the electrolyte chamber. Contact elements (11) are also provided for contacting the printed circuit boards electrically. Electrolyte spray devices (13) for spraying the electrolyte liquid against the surfaces of the printed circuit boards are also provided. Openings are made in the counter electrodes. The electrolyte spray devices are arranged on the sides of the electrodes facing away from the plane of conveyance in such a way that the electrolyte fluid leaving the devices is able to pass through the counter electrodes at the point of the openings in an essentially unobstructed manner and can reach the surfaces of the printed circuit boards.
IPC 1-7
IPC 8 full level
C25D 5/08 (2006.01); C25D 7/00 (2006.01); C25D 7/06 (2006.01); C25D 17/00 (2006.01); H05K 3/18 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP US)
C25D 5/08 (2013.01 - EP US); C25D 17/00 (2013.01 - EP US); H05K 3/241 (2013.01 - EP US)
Citation (search report)
See references of WO 9849374A2
Designated contracting state (EPC)
AT CH DE ES FI FR GB IT LI NL SE
DOCDB simple family (publication)
DE 19717512 A1 19981029; DE 19717512 C2 19990311; DE 19717512 C3 20030618; CA 2287274 A1 19981105; EP 1051886 A2 20001115; JP 2002506483 A 20020226; JP 4210339 B2 20090114; US 6238529 B1 20010529; WO 9849374 A2 19981105; WO 9849374 A3 20000824
DOCDB simple family (application)
DE 19717512 A 19970425; CA 2287274 A 19980407; DE 9801034 W 19980407; EP 98931898 A 19980407; JP 54647498 A 19980407; US 40365799 A 19991122