EP 1054417 A1 20001122 - Microcomponents of microinductance or microtransformer type and manufacturing process
Title (en)
Microcomponents of microinductance or microtransformer type and manufacturing process
Title (de)
Mikrokomponente wie Mikroinduktanz oder Mikrotransformator und Herstellungsverfahren
Title (fr)
Micro-composants du type micro-inductance ou micro-transformateur, et procédé de fabrication de tels micro-composants
Publication
Application
Priority
FR 9906433 A 19990518
Abstract (en)
The microcomponent manufacture technique has a substrate etched with a number of channels. Copper is deposited by electrolys in the channels and planed flat. A central section (12) is deposited above the segments (7). The central section is then etched for arch sections, each arc connected to an adjacent segment and forming a spiral winding.
IPC 1-7
IPC 8 full level
H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 17/06 (2006.01); H01F 41/04 (2006.01)
CPC (source: EP US)
H01F 17/0033 (2013.01 - EP US); H01F 41/042 (2013.01 - EP US); H01F 41/046 (2013.01 - EP US); Y10T 29/4902 (2015.01 - EP US)
Citation (search report)
- [X] US 5884990 A 19990323 - BURGHARTZ JOACHIM NORBERT [US], et al
- [A] EP 0727771 A2 19960821 - AIWA CO [JP]
- [A] LOECHEL B ET AL: "SENSORS AND ACTUATORS A,CH,ELSEVIER SEQUOIA S.A., LAUSANNE", SENSORS AND ACTUATORS A,CH,ELSEVIER SEQUOIA S.A., LAUSANNE, vol. A54, no. 1/03, pages 663-667, XP000637191, ISSN: 0924-4247
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1054417 A1 20001122; CA 2308871 A1 20001118; FR 2793943 A1 20001124; FR 2793943 B1 20010713; JP 2000353617 A 20001219; US 6429764 B1 20020806
DOCDB simple family (application)
EP 00420093 A 20000510; CA 2308871 A 20000511; FR 9906433 A 19990518; JP 2000133972 A 20000502; US 55864100 A 20000426