Global Patent Index - EP 1054646 A1

EP 1054646 A1 20001129 - ENCAPSULATED INTRALUMINAL STENT-GRAFT AND METHODS OF MAKING SAME

Title (en)

ENCAPSULATED INTRALUMINAL STENT-GRAFT AND METHODS OF MAKING SAME

Title (de)

EINGEKAPSELTES ENDOLUMINALES STENTTRANSPLANTAT UND VERFAHREN ZU SEINER HERSTELLUNG

Title (fr)

STENT-GREFFON INTRALUMINAL ENCAPSULE ET PROCEDE DE FABRICATION ASSOCIE

Publication

EP 1054646 A1 20001129 (EN)

Application

EP 98918939 A 19980504

Priority

  • US 9808994 W 19980504
  • US 9802361 W 19980202

Abstract (en)

[origin: WO9938455A1] Shape memory alloy and elastically self-expanding endoluminal stents which are at least partially encapsulated in a substantially monolithic expanded polytetrafluoroethylene ("ePTFE") covering. An endoluminal stent, which has a reduced diametric dimension for endoluminal delivery and a larger in vivo final diametric diameter, is encapsulated in an ePTFE covering which circumferentially covers both the luminal and abluminal walls along at least a portion of the longitudinal extent of the endoluminal stent. The shape memory endoluminal stent is fabricated from a shape memory alloy which exhibits either shape memory or pseudoelastic properties or from an elastic material having an inherent spring tension.

IPC 1-7

A61F 2/06

IPC 8 full level

A61F 2/06 (2006.01); A61F 2/07 (2013.01); A61F 2/84 (2006.01); A61F 2/90 (2013.01); A61F 2/95 (2013.01); A61F 2/966 (2013.01); A61L 27/00 (2006.01); A61L 31/10 (2006.01)

CPC (source: EP US)

A61F 2/07 (2013.01 - EP); A61F 2/95 (2013.01 - EP); A61F 2/966 (2013.01 - EP US); A61L 31/10 (2013.01 - EP); A61F 2/90 (2013.01 - EP); A61F 2002/072 (2013.01 - EP); A61L 2400/16 (2013.01 - EP)

Citation (search report)

See references of WO 9938455A1

Designated contracting state (EPC)

BE DE ES FR GB IT NL

DOCDB simple family (publication)

WO 9938455 A1 19990805; AU 7175998 A 19990816; AU 733860 B2 20010531; CA 2318829 A1 19990805; CA 2318829 C 20071113; EP 1054646 A1 20001129; JP 2002501779 A 20020122; JP 4057238 B2 20080305

DOCDB simple family (application)

US 9808994 W 19980504; AU 7175998 A 19980504; CA 2318829 A 19980504; EP 98918939 A 19980504; JP 2000529191 A 19980504