Global Patent Index - EP 1057080 A1

EP 1057080 A1 20001206 - RESIST STRIPPING PROCESS

Title (en)

RESIST STRIPPING PROCESS

Title (de)

RESISTENTFERNUNGSVERFAHREN

Title (fr)

PROCEDE DE DECAPAGE DE RESIST

Publication

EP 1057080 A1 20001206 (EN)

Application

EP 99905603 A 19990201

Priority

  • US 9902160 W 19990201
  • US 3115498 A 19980226

Abstract (en)

[origin: WO9944101A1] A process for removing patterned resist from the surface of a substrate during manufacture of printed wiring boards is disclosed. The process includes the steps of contacting the patterned resist with a stripping solution containing an alkalinity source as well as a source of ammonium ions. The stripping solution is characterized in that it does not contain volatile organic compounds (VOCs).

IPC 1-7

G03F 7/42

IPC 8 full level

G03F 7/42 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/00 (2006.01)

CPC (source: EP KR)

G03F 7/34 (2013.01 - KR); G03F 7/40 (2013.01 - KR); G03F 7/422 (2013.01 - KR); G03F 7/425 (2013.01 - EP KR); G03F 7/426 (2013.01 - KR); H05K 3/0073 (2013.01 - EP)

Citation (search report)

See references of WO 9944101A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

WO 9944101 A1 19990902; CN 1129036 C 20031126; CN 1298496 A 20010606; EP 1057080 A1 20001206; JP 2002505448 A 20020219; KR 20010041221 A 20010515; TW 407449 B 20001001

DOCDB simple family (application)

US 9902160 W 19990201; CN 99804505 A 19990201; EP 99905603 A 19990201; JP 2000533792 A 19990201; KR 20007009310 A 20000823; TW 88101903 A 19990208