EP 1057850 A2 20001206 - LCP bonding method
Title (en)
LCP bonding method
Title (de)
Verbindungsverfahren von Flüssigkristall-Polymeren
Title (fr)
Procédé de soudage de polymères à cristaux liquides
Publication
Application
Priority
JP 15387899 A 19990601
Abstract (en)
A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.
IPC 1-7
IPC 8 full level
C08J 5/12 (2006.01); C09J 5/00 (2006.01); C09J 163/00 (2006.01); C09J 179/00 (2006.01); C09J 179/08 (2006.01); H01L 21/58 (2006.01)
CPC (source: EP US)
C08J 5/128 (2013.01 - EP US); C08L 63/00 (2013.01 - EP US); C09J 163/00 (2013.01 - EP US); C09J 179/08 (2013.01 - EP US); H01L 24/29 (2013.01 - EP US); H01L 24/83 (2013.01 - EP US); C08L 2666/20 (2013.01 - EP US); H01L 2224/29 (2013.01 - EP US); H01L 2224/29101 (2013.01 - EP US); H01L 2224/2919 (2013.01 - EP US); H01L 2224/2929 (2013.01 - EP US); H01L 2224/29386 (2013.01 - EP US); H01L 2224/29388 (2013.01 - EP US); H01L 2224/29393 (2013.01 - EP US); H01L 2224/8319 (2013.01 - EP US); H01L 2224/8385 (2013.01 - EP US); H01L 2924/00013 (2013.01 - EP US); H01L 2924/01004 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/0102 (2013.01 - EP US); H01L 2924/01027 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01033 (2013.01 - EP US); H01L 2924/01047 (2013.01 - EP US); H01L 2924/01051 (2013.01 - EP US); H01L 2924/01074 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/0665 (2013.01 - EP US); H01L 2924/07802 (2013.01 - EP US); H01L 2924/181 (2013.01 - EP US)
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 1057850 A2 20001206; EP 1057850 A3 20001220; JP 2000345132 A 20001212; US 6331226 B1 20011218
DOCDB simple family (application)
EP 00304557 A 20000530; JP 15387899 A 19990601; US 57739500 A 20000525