Global patent index - EP 1059019 A1

EP 1059019 A1 2000-12-13 - COMPONENTS WITH RELEASABLE LEADS

Title (en)

COMPONENTS WITH RELEASABLE LEADS

Title (de)

BAUTEILEN MIT LÖSBAREN LEITERN

Title (fr)

COMPOSANTS DOTES DE FILS DETACHABLES

Publication

EP 1059019 A1 (EN)

Application

EP 99905891 A

Priority

  • US 9902748 W
  • US 2075098 A
  • US 19537198 A
  • US 22566999 A

Abstract (en)

[origin: WO9940761A1] A microelectronic component is made by providing a starting structure having a dielectric layer (22) and leads on a surface of the dielectric layer. The dielectric layer is etched to partially detach the leads (24) from the dielectric layer, leaving a portion of each lead releasably connected to the dielectric layer. Ends of the leads (24) may be connected to contacts (52) on a microelectronic element (50), such as the contacts on a semiconductor chip or wafer, before the dielectric layer (22) is etched to partially detach the leads (24) from the dielectric layer. The lead is partially detached from the dielectric layer so that the dielectric layer can be broken or peeled away from the leads during the step of moving the microelectronic element (50) and dielectric layer (22) away from one another.

IPC 1-7 (main, further and additional classification)

H05K 3/30; H01R 9/09

IPC 8 full level (invention and additional information)

H05K 3/32 (2006.01); H01L 21/48 (2006.01); H01L 21/60 (2006.01); H01L 23/13 (2006.01); H01L 23/32 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H05K 3/40 (2006.01)

CPC (invention and additional information)

H05K 3/4092 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/49811 (2013.01); H01L 23/4985 (2013.01); H01L 24/13 (2013.01); H01L 24/72 (2013.01); H01L 24/81 (2013.01); H01L 2223/6622 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01061 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1903 (2013.01); H01L 2924/3011 (2013.01)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9940761 A1 19990812; AU 2594399 A 19990823; EP 1059019 A1 20001213; EP 1059019 A4 20071017; JP 2002503038 A 20020129

INPADOC legal status

2008-11-26 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20080603

2008-02-20 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20080122

2007-10-17 [A4] SUPPLEMENTARY SEARCH REPORT

- Ref Legal Event Code: A4

- Effective date: 20070830

2000-12-13 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20000809

2000-12-13 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE