EP 1060144 A1 20001220 - GLASS FIBER-REINFORCED LAMINATES, ELECTRONIC CIRCUIT BOARDS AND METHODS FOR ASSEMBLING A FABRIC
Title (en)
GLASS FIBER-REINFORCED LAMINATES, ELECTRONIC CIRCUIT BOARDS AND METHODS FOR ASSEMBLING A FABRIC
Title (de)
GLASFASERVERSTÄRKTE LAMINATE, ELEKTRISCHE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINES GEWEBES
Title (fr)
STRATIFIES RENFORCES PAR DES FIBRES DE VERRE, PLAQUETTES DE CIRCUITS ELECTRONIQUES ET PROCEDES D'ASSEMBLAGE D'UN TISSU DE RENFORT
Publication
Application
Priority
- US 9904086 W 19990225
- US 3452598 A 19980303
- US 13027098 A 19980806
- US 17057898 A 19981013
Abstract (en)
[origin: WO9944959A1] The present invention provides reinforced laminates for printed circuit boards having a woven reinforcement fabric of a yarn including E-glass fibers having a coating which is compatible with the polymeric matrix material. The yarn has a loss on ignition ranging from about 0.01 to about 0.6 weight percent and an Air Jet Transport Drag Force of greater than about one gram force per gram mass of yarn evaluated using a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a yarn feed rate of about 274 meters (about 300 yards) per minute and an air pressure of about 310 kiloPascals (about 45 pounds per square inch) gauge. The laminate has a flexural strength in the fill direction of the fabric greater than about 3 x 10<7> kilograms per square meter (about 42.7 kpsi). The yarn coating can include polyester and a polymer selected from vinyl pyrrolidone polymers, vinyl alcohol polymers, starches and mixtures thereof. Alternatively, the laminate has a coefficient of thermal expansion in the z-direction of less than about 4.5 percent at a temperature of 288 DEG C.
IPC 1-7
IPC 8 full level
B32B 5/00 (2006.01); C03C 25/10 (2006.01); C03C 25/28 (2006.01); B29B 15/10 (2006.01); C03C 25/32 (2006.01); C03C 25/42 (2006.01); C08J 5/08 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01)
CPC (source: EP)
C03C 25/28 (2013.01); C03C 25/32 (2013.01); C03C 25/42 (2013.01); C03C 25/47 (2018.01); C08J 5/08 (2013.01); H05K 1/0366 (2013.01); H05K 3/0047 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0212 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/029 (2013.01); H05K 2203/127 (2013.01)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB IT LI NL PT SE
DOCDB simple family (publication)
WO 9944959 A1 19990910; AU 2788999 A 19990920; BR 9908520 A 20001024; CA 2320746 A1 19990910; CN 1291963 A 20010418; EP 1060144 A1 20001220; HU P0101382 A2 20010828; HU P0101382 A3 20021028; ID 26528 A 20010111; IL 137977 A0 20011031; JP 2002505216 A 20020219; KR 20010041518 A 20010525; MX PA00008517 A 20010301; MX PA00008554 A 20010301; NO 20004272 D0 20000825; NO 20004272 L 20001101; PL 342654 A1 20010702; TR 200002520 T2 20010122; TW 436422 B 20010528
DOCDB simple family (application)
US 9904086 W 19990225; AU 2788999 A 19990225; BR 9908520 A 19990225; CA 2320746 A 19990225; CN 99803572 A 19990225; EP 99908457 A 19990225; HU P0101382 A 19990225; ID 20001683 A 19990225; IL 13797799 A 19990225; JP 2000534512 A 19990225; KR 20007009688 A 20000901; MX PA00008517 A 20000831; MX PA00008554 A 20000901; NO 20004272 A 20000825; PL 34265499 A 19990225; TR 200002520 T 19990225; TW 88103238 A 19990527