EP 1062698 A1 20001227 - ELECTRONIC SEMICONDUCTOR MODULE
Title (en)
ELECTRONIC SEMICONDUCTOR MODULE
Title (de)
ELEKTRONISCHES HALBLEITERMODUL
Title (fr)
MODULE SEMI-CONDUCTEUR ELECTRONIQUE
Publication
Application
Priority
- DE 9904085 W 19991223
- DE 19900603 A 19990111
Abstract (en)
[origin: DE19900603A1] In order to improve the dissipation of heat and to reduce parasitic inductivities in an electronic semiconductor module that consists of a carrier substrate (1) with an electrically insulating layer (2), a metal layer (4) arranged on the top surface of the insulating layer whereby strip conductors (4a) are configured inside said metal layer, and a metal cooling body (3) that is placed on the bottom side of the insulating layer, in addition to at least one semiconductor element arranged on the carrier substrate, the electrically insulating layer that is provided with at least one recess (13) and at least one connecting surface (22) that is located on the top side of the semiconductor element opposite the carrier substrate is electrically connected to a contact element (2) that is directly brought into contact with the metal cooling body via the recess.
IPC 1-7
IPC 8 full level
H01L 23/36 (2006.01); H01L 23/473 (2006.01); H01L 23/64 (2006.01)
CPC (source: EP KR US)
H01L 23/36 (2013.01 - EP US); H01L 23/645 (2013.01 - EP US); H01L 24/48 (2013.01 - EP US); H01L 25/00 (2013.01 - KR); H01L 2224/05599 (2013.01 - EP US); H01L 2224/48091 (2013.01 - EP US); H01L 2224/48227 (2013.01 - EP US); H01L 2224/48228 (2013.01 - EP US); H01L 2224/484 (2013.01 - EP US); H01L 2224/85399 (2013.01 - EP US); H01L 2924/00014 (2013.01 - EP US); H01L 2924/01005 (2013.01 - EP US); H01L 2924/01006 (2013.01 - EP US); H01L 2924/01011 (2013.01 - EP US); H01L 2924/01013 (2013.01 - EP US); H01L 2924/01015 (2013.01 - EP US); H01L 2924/01029 (2013.01 - EP US); H01L 2924/01052 (2013.01 - EP US); H01L 2924/014 (2013.01 - EP US); H01L 2924/1305 (2013.01 - EP US); H01L 2924/13055 (2013.01 - EP US); H01L 2924/13091 (2013.01 - EP US); H01L 2924/19041 (2013.01 - EP US); H01L 2924/19107 (2013.01 - EP US); H01L 2924/30107 (2013.01 - EP US)
Citation (search report)
See references of WO 0042654A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DE 19900603 A1 20000713; EP 1062698 A1 20001227; JP 2002535835 A 20021022; KR 100695031 B1 20070314; KR 20010041692 A 20010525; US 6373705 B1 20020416; WO 0042654 A1 20000720
DOCDB simple family (application)
DE 19900603 A 19990111; DE 9904085 W 19991223; EP 99967900 A 19991223; JP 2000594153 A 19991223; KR 20007009911 A 20000907; US 62397101 A 20010213