EP 1063056 A2 20001227 - Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process
Title (en)
Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process
Title (de)
Verfahren und Vorrichtung zum Messen eines Polierkissenprofils und Steuerung mit geschlossenem Regelkreis eines Polierkissen Aufbereitungsverfahren
Title (fr)
Procédé et dispositif pour mesurer le profil d'un tampon de polissage et commande en boucle fermée du processus de dressage d'un tampon
Publication
Application
Priority
US 33835799 A 19990622
Abstract (en)
A method and apparatus for enhancing the process performance over the life of a polishing pad (120) in a chemical-mechanical polishing apparatus (80) employs closed loop control of polishing pad wear. A contactless displacement sensor (175), such as a laser displacement sensor, provides feedback that is used to generate a pad profile of the polishing pad. Conditioning apparatus (130) is then controlled in response to the feedback from the laser displacement sensor in a closed loop control to modify the conditioning process and control the pad wear uniformity. <IMAGE> <IMAGE>
IPC 1-7
IPC 8 full level
B24B 37/00 (2006.01); B24B 37/04 (2006.01); B24B 49/12 (2006.01); B24B 53/00 (2006.01); B24B 53/007 (2006.01); B24B 53/017 (2012.01); G01B 11/00 (2006.01); G01B 11/06 (2006.01); H01L 21/304 (2006.01)
CPC (source: EP)
B24B 49/12 (2013.01); B24B 53/017 (2013.01)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1063056 A2 20001227; EP 1063056 A3 20030326; JP 2001129754 A 20010515; TW 466153 B 20011201
DOCDB simple family (application)
EP 00305242 A 20000621; JP 2000187913 A 20000622; TW 89110081 A 20000524