Global Patent Index - EP 1063174 A1

EP 1063174 A1 20001227 - Tamper proof package and method of manufacturing it

Title (en)

Tamper proof package and method of manufacturing it

Title (de)

Verpackung mit Originalitätssicherung und Verfahren zu deren Herstellung

Title (fr)

Emballage avec garantie d'inviolabilité et procédé pour sa fabrication

Publication

EP 1063174 A1 20001227 (FR)

Application

EP 99490015 A 19990610

Priority

EP 99490015 A 19990610

Abstract (en)

A package is a hermetically sealed pocket formed from two structures. The first structure has a support layer, an adhesive layer and a sealable internal layer. The second structure has a sealable layer or is similar to the first structure. An opening in the package is formed by two zones between the two sealable layers. The first zone is a breakable coating and the second zone is resealable. An Independent claim is included for manufacturing a package as above.

IPC 1-7

B65D 77/20; B65D 75/58; B65B 7/28

IPC 8 full level

B65B 7/28 (2006.01); B65D 75/58 (2006.01); B65D 77/20 (2006.01)

CPC (source: EP)

B65B 7/2878 (2013.01); B65D 75/5855 (2013.01); B65D 77/2044 (2013.01); B65D 77/2096 (2013.01)

Citation (search report)

Designated contracting state (EPC)

AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1063174 A1 20001227; EP 1063174 B1 20040414; AT E264236 T1 20040415; DE 69916439 D1 20040519; DE 69916439 T2 20050421; DK 1063174 T3 20040816; ES 2220023 T3 20041201

DOCDB simple family (application)

EP 99490015 A 19990610; AT 99490015 T 19990610; DE 69916439 T 19990610; DK 99490015 T 19990610; ES 99490015 T 19990610