Global Patent Index - EP 1064421 A1

EP 1064421 A1 2001-01-03 - BASE WEBS FOR PRINTED CIRCUIT BOARD PRODUCTION USING THE FOAM PROCESS AND ARAMID FIBERS

Title (en)

BASE WEBS FOR PRINTED CIRCUIT BOARD PRODUCTION USING THE FOAM PROCESS AND ARAMID FIBERS

Title (de)

GRUNDBAHNEN FÜR DIE HERSTELLUNG VON LEITERPLATTEN DURCH SCHAUMVERFAHREN MIT ARAMIDFASERN

Title (fr)

BANDES DE BASE POUR LA PRODUCTION DE PLAQUETTES A CIRCUITS IMPRIMES UTILISANT LE GONFLEMENT DE LA MOUSSE ET DES FIBRES ARAMIDES

Publication

EP 1064421 A1 (EN)

Application

EP 99908993 A

Priority

  • FI 9900215 W
  • US 7870898 P
  • US 10827898 A

Abstract (en)

[origin: WO9949118A1] A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 10 % weight aramid fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and at least about 10 % (e.g. at least about 60 %) of the aramid fibers utilized are aramid pulp fibers which have a number of advantages compared to the conventional straight aramid fibers. The web or sheet is preferably compressed so that it has a density of about 0.1-0.2 grams per cubic. centimeter; and the web or sheet has a basis weight of between about 20-120 grams per square meter. The web may also have a substantially electrically non-conductive binder such as PVA or an epoxy resin. A printed circuit board made using the aramid layers of non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics.

IPC 1-7 (main, further and additional classification)

D04H 1/42; H05K 1/03

IPC 8 full level (invention and additional information)

B32B 5/26 (2006.01); B29C 70/12 (2006.01); B32B 17/02 (2006.01); D04H 1/42 (2006.01); D21H 13/26 (2006.01); H05K 1/03 (2006.01); D21H 17/36 (2006.01); D21H 17/52 (2006.01); H05K 3/02 (2006.01)

CPC (invention and additional information)

B29C 70/12 (2013.01); D21H 13/26 (2013.01); H05K 1/0366 (2013.01); B29K 2105/128 (2013.01); B29L 2031/3425 (2013.01); D21H 17/36 (2013.01); D21H 17/52 (2013.01); H05K 3/022 (2013.01); H05K 2201/0278 (2013.01); H05K 2201/0293 (2013.01)

Citation (search report)

See references of WO 9949118A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

WO 9949118 A1 19990930; AU 2839299 A 19991018; AU 747347 B2 20020516; BR 9908950 A 20001121; CA 2323642 A1 19990930; CN 1301316 A 20010627; EP 1064421 A1 20010103; JP 2002507670 A 20020312; NO 20004666 A 20001116; NO 20004666 D0 20000919; PL 343028 A1 20010730

INPADOC legal status


2004-01-07 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20030704

2001-08-08 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20010620

2001-01-03 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20001013

2001-01-03 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE