EP 1068499 A1 20010117 - PACKAGED DEVICE
Title (en)
PACKAGED DEVICE
Title (de)
VERKAPSELTE ANORDNUNG
Title (fr)
DISPOSITIF ENCAPSULE
Publication
Application
Priority
- GB 0000298 W 20000203
- GB 9902341 A 19990203
- GB 0002433 A 20000203
Abstract (en)
[origin: WO0046580A1] A transducer has a closure for components mounted on the substrate (13) comprising: a lid component (16); and a peripheral component (17) of plastics material secured by one side to the lid component (16) and by the other side to the one side to the substrate (13); the lid component (16) and the peripheral component (17) serve to define a hermetically sealed enclosure (18) for the electrode structure (12). The invention further comprises a workpiece bearing the transducer to enable strain generated in the workpiece to be examined by way of the transducer.
IPC 1-7
IPC 8 full level
H01L 23/02 (2006.01); H03H 3/08 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01)
CPC (source: EP)
H03H 9/1071 (2013.01)
Citation (search report)
See references of WO 0046580A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 0046580 A1 20000810; AU 2446000 A 20000825; BR 0004588 A 20020205; CA 2326981 A1 20000810; CN 1300362 A 20010620; EP 1068499 A1 20010117; JP 2002536894 A 20021029
DOCDB simple family (application)
GB 0000298 W 20000203; AU 2446000 A 20000203; BR 0004588 A 20000203; CA 2326981 A 20000203; CN 00800489 A 20000203; EP 00902715 A 20000203; JP 2000597613 A 20000203