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Current content: 155 519 367 patent documents

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123 361 new documents added

1 354 331 documents amended

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EP 1069211 A2 20010117 - Electroplating solutions

Title (en)

Electroplating solutions

Title (de)

Elektroplattierungslösungen

Title (fr)

Solutions pour l'électroplacage

Publication

EP 1069211 A2 20010117 (EN)

Application

EP 00305941 A 20000713

Priority

US 14415999 P 19990715
US 58359900 A 20000531

Abstract (en)

An acid copper electroplating composition comprising an aqueous solution of an acid and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing organic brightener compound and a leveller compound which comprises an organic compound containing single or multiple charged centres are present.

IPC 1-7

C25D 3/38

IPC 8 full level

C25D 3/38 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01)

CPC (source: EP KR US)

C25D 3/38 (2013.01 - EP KR US)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1069211 A2 20010117; EP 1069211 A3 20031217; JP 2001073182 A 20010321; KR 20010015342 A 20010226; US 2004187731 A1 20040930

DOCDB simple family (application)

EP 00305941 A 20000713; JP 2000210188 A 20000711; KR 20000040658 A 20000714; US 82398204 A 20040414