EP 1069211 A2 20010117 - Electroplating solutions
Title (en)
Electroplating solutions
Title (de)
Elektroplattierungslösungen
Title (fr)
Solutions pour l'électroplacage
Publication
Application
Priority
- US 14415999 P 19990715
- US 58359900 A 20000531
Abstract (en)
An acid copper electroplating composition comprising an aqueous solution of an acid and a copper salt, wherein at least one carrier compound, a water-soluble, mercapto-containing organic brightener compound and a leveller compound which comprises an organic compound containing single or multiple charged centres are present.
IPC 1-7
IPC 8 full level
C25D 3/38 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01)
CPC (source: EP KR US)
C25D 3/38 (2013.01 - EP KR US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1069211 A2 20010117; EP 1069211 A3 20031217; JP 2001073182 A 20010321; KR 20010015342 A 20010226; US 2004187731 A1 20040930
DOCDB simple family (application)
EP 00305941 A 20000713; JP 2000210188 A 20000711; KR 20000040658 A 20000714; US 82398204 A 20040414