EP 1069972 A1 20010124 - APPARATUS AND METHODS FOR SLURRY REMOVAL IN CHEMICAL MECHANICAL POLISHING
Title (en)
APPARATUS AND METHODS FOR SLURRY REMOVAL IN CHEMICAL MECHANICAL POLISHING
Title (de)
VERFAHREN UND VORRICHTUNG ZUM ENTFERNEN VON AUFSCHLÄMMUNG IM CHEMISCH-MECHANISCHEN POLIEREN
Title (fr)
DISPOSITIF ET PROCEDES SERVANT A ENLEVER UNE PATE DE POLISSAGE CHIMIOMECANIQUE
Publication
Application
Priority
- US 9907418 W 19990402
- US 5770498 A 19980408
Abstract (en)
[origin: WO9951398A1] A substrate and carrier head cleaning station (55b) is part of a chemical mechanical polishing apparatus. The cleaning station (55b) is positioned between two polishing stations to prevent slurry contamination therebetween. The cleaner may include a wash cup (100), a rotating scrub brush (112), and a nozzle (122) to direct a cleaning fluid (124) onto the substrate. Alternately, in a CMP apparatus having three polishing stations, the second station may be equipped with a soft polishing pad and be used as an intermediate cleaning station.
IPC 1-7
IPC 8 full level
B08B 1/04 (2006.01); B24B 37/00 (2006.01); B24B 37/04 (2006.01); B24B 37/34 (2012.01); B24B 55/06 (2006.01); B24B 57/02 (2006.01); H01L 21/00 (2006.01); H01L 21/304 (2006.01); H01L 21/3105 (2006.01)
CPC (source: EP)
B24B 37/345 (2013.01); B24B 57/02 (2013.01); H01L 21/31053 (2013.01); H01L 21/67046 (2013.01); H01L 21/67051 (2013.01)
Citation (search report)
See references of WO 9951398A1
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9951398 A1 19991014; EP 1069972 A1 20010124; JP 2002510875 A 20020409; TW 393378 B 20000611
DOCDB simple family (application)
US 9907418 W 19990402; EP 99916363 A 19990402; JP 2000542149 A 19990402; TW 88104577 A 19990323