EP 1072689 B1 20040407 - Process of manufacturing thin "TRIP" type steel strips and strips obtained thereby
Title (en)
Process of manufacturing thin "TRIP" type steel strips and strips obtained thereby
Title (de)
Verfahren zum Herstellen von dünnen "TRIP"-Typ-Stahlbändern und also hergestellte Stahlbändern
Title (fr)
Procédé de fabrication de bandes minces en acier de type "TRIP" , et bandes minces ainsi obtenues
Publication
Application
Priority
FR 9910060 A 19990730
Abstract (en)
[origin: EP1072689A1] To make the TRIP (TRansformation Induced Plasticity) band, the band is continuously cast, 1.5-10 mm thick, preferably 1-5 mm thick. Composition is C 0.5-0.25, (Mn+Cu+Ni) is 0.5-3%, (Si+Al) is 0.1-4%, (P+Sn+As+Sb) is up to 0.1%, (Ti+Nb+V+Zr+rare earths) is up to 0.3%, Cr is below 1%, as are Mo, V; the balance being iron and impurities. The band is hot-laminated above the steel Ar3 temperature, with a reduction of 25-70% in one or more passes. The first forced cooling takes place at 5-100 degrees C/s. The band is held at 550-400 degrees C sufficiently long for the bainitic transformation with a proportion of residual austenite exceeding 5%, whilst avoiding perlite formation. The transformation is interrupted by a second forced cooling to 400 degrees C. The band is finally wound up, below 350 degrees C. An Independent claim is included for the band of steel so produced.
IPC 1-7
IPC 8 full level
B22D 11/00 (2006.01); B22D 11/06 (2006.01); B22D 11/12 (2006.01); B22D 11/20 (2006.01); B22D 11/22 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/58 (2006.01); C21D 1/20 (2006.01)
CPC (source: EP KR US)
C21D 8/02 (2013.01 - KR); C21D 8/0215 (2013.01 - EP US); C21D 8/0226 (2013.01 - EP US); C21D 1/20 (2013.01 - EP US); C21D 2211/001 (2013.01 - EP US); C21D 2211/002 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1072689 A1 20010131; EP 1072689 B1 20040407; AT E263846 T1 20040415; BR 0003612 A 20010313; CA 2314830 A1 20010130; CA 2314830 C 20090317; DE 60009611 D1 20040513; DE 60009611 T2 20050331; FR 2796966 A1 20010202; FR 2796966 B1 20010921; JP 2001073040 A 20010321; JP 2011047054 A 20110310; JP 4684397 B2 20110518; KR 100656974 B1 20061215; KR 20010021143 A 20010315; US 6328826 B1 20011211
DOCDB simple family (application)
EP 00402035 A 20000717; AT 00402035 T 20000717; BR 0003612 A 20000731; CA 2314830 A 20000717; DE 60009611 T 20000717; FR 9910060 A 19990730; JP 2000228065 A 20000728; JP 2010254560 A 20101115; KR 20000043676 A 20000728; US 62108900 A 20000721