EP 1075043 A1 20010207 - Antenna with stacked resonating structures and multiband radiocommunication device using the same
Title (en)
Antenna with stacked resonating structures and multiband radiocommunication device using the same
Title (de)
Antenne mit übereinanderliegenden Resonanzstrukturen und Multibandfunkkommunikationsendgerät mit einer derartigen Antenne
Title (fr)
Antenne à empilement de structures résonantes et dispositif de radiocommunication multifréquence incluant cette antenne
Publication
Application
Priority
FR 9910180 A 19990805
Abstract (en)
[origin: JP2001077623A] PROBLEM TO BE SOLVED: To obtain a small-sized antenna in a stack structure with sufficient passing band width by eliminating mutual interference by coupling a resonance structure which has a high center frequency ratio on both sides of a coupling layer made of the planar conductive layer with an external processing unit via a slit formed in the coupling layer. SOLUTION: A lower conductive layer A, a lower dielectric layer B, a coupling layer C, an upper dielectric layer D, and an upper conductive layer E are stacked vertically in order, and the layers A, B, and C form a lower resonance structure and the layers C, D, and E form the upper resonance structure. The coupling layer C has two coupling slits CF extending from a back end along a length DL and a coupling strip CR form a coplanar line and an internal coupling device. The upper and lower resonance structures are both a patch type, the coupling layer C constitutes the patch of the lower resonance structure and an internal part of a base plate of the upper resonance structure, and the patch of the upper resonance structure is composed of the upper conductive layer E. Furthermore, the lower and upper resonance structures are made into quarter-wavelength and half-wavelength types respectively and substrate which are equal in thickness and dielectric constant can be used.
Abstract (fr)
Une antenne à empilement de structures résonantes inclut : une ligne de guidage (CR, CF) pour ondes électromagnétiques, cette ligne étant formée dans une couche conductrice (C) s'étendant dans un plan, et deux structures résonantes (ABC,CDE) ayant deux fréquences de résonance respectives mutuellement différentes, ces deux structures étant formées de part et d'autre de ce plan de manière à être toutes deux couplées directement à cette ligne tout en étant sensiblement découplées l'une de l'autre par cette couche conductrice (C). De préférence la ligne de guidage est du type coplanaire, et les deux structures résonantes sont du type quart d'onde. L'invention s'applique notamment aux radiotéléphones bi-bandes. <IMAGE>
IPC 1-7
IPC 8 full level
H01Q 21/30 (2006.01); H01Q 1/24 (2006.01); H01Q 1/38 (2006.01); H01Q 5/00 (2006.01); H01Q 5/10 (2015.01); H01Q 5/385 (2015.01); H01Q 9/04 (2006.01); H01Q 13/08 (2006.01)
CPC (source: EP US)
H01Q 1/242 (2013.01 - EP US); H01Q 5/385 (2015.01 - EP US); H01Q 9/0407 (2013.01 - EP US); H01Q 9/0414 (2013.01 - EP US); H01Q 9/0421 (2013.01 - EP US); H01Q 9/045 (2013.01 - EP US)
Citation (search report)
- [A] EP 0871238 A2 19981014 - NOKIA MOBILE PHONES LTD [FI]
- [A] US 4070676 A 19780124 - SANFORD GARY G
- [A] EP 0924797 A1 19990623 - CIT ALCATEL [FR]
- [A] US 5075691 A 19911224 - GARAY OSCAR [US], et al
- [A] EP 0795926 A2 19970917 - ASCOM TECH AG [CH]
- [A] ORMISTON T D ET AL: "MICROSTRIP SHORT-CIRCUIT PATCH DESIGN EQUATIONS", MICROWAVE AND OPTICAL TECHNOLOGY LETTERS,US,JOHN WILEY, NEW YORK, NY, vol. 16, no. 1, 1 September 1997 (1997-09-01), pages 12 - 14, XP000198277, ISSN: 0895-2477
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
EP 1075043 A1 20010207; AU 4892800 A 20010208; CA 2314826 A1 20010205; CN 1184838 C 20050112; CN 1283941 A 20010214; FR 2797352 A1 20010209; FR 2797352 B1 20070420; JP 2001077623 A 20010323; SG 109428 A1 20050330; US 6304220 B1 20011016
DOCDB simple family (application)
EP 00402192 A 20000731; AU 4892800 A 20000731; CA 2314826 A 20000714; CN 00122532 A 20000804; FR 9910180 A 19990805; JP 2000237571 A 20000804; SG 200004373 A 20000804; US 63261300 A 20000804