EP 1076727 B1 20050601 - MULTILAYER BOND COAT FOR A THERMAL BARRIER COATING SYSTEM AND PROCESS THEREFOR
Title (en)
MULTILAYER BOND COAT FOR A THERMAL BARRIER COATING SYSTEM AND PROCESS THEREFOR
Title (de)
MEHRSCHICHTIGE HAFTBESCHICHTUNG FÜR WÄRMEDÄMMSCHICHT UND VERFAHREN DAZU
Title (fr)
REVETEMENT DE LIAISON MULTICOUCHE POUR SYSTEME DE REVETEMENT A BARRIERE THERMIQUE ET PROCEDE Y RELATIF
Publication
Application
Priority
- US 9904339 W 19990226
- US 7639198 P 19980228
- US 25964999 A 19990226
Abstract (en)
[origin: WO9943861A1] A method of depositing a bond coat (16) of a thermal barrier coating (TBC) system (14) for components designed for use in a hostile thermal environment, such as turbine, combustor and augmentor components (10) of a gas turbine engine. The method yields a dense, bi-layer bond coat (16) having an adequate surface roughness for adhering a plasma-sprayed ceramic layer (18). The method generally entails depositing a first bond coat layer (16a) using a high velocity oxy-fuel (HVOF) technique employing a relatively fine metallic powder having a relatively narrow size distribution. Following heat treatment, a second bond coat layer (16b) is deposited on the first bond coat layer (16a) by air plasma spraying (APS) a relatively coarser metallic powder of particles having a relatively broader size distribution. The resulting second bond coat layer (16b) is characterized by a macro-surface roughness of about 450 to about 750 microinches Ra. Following a second heat treatment, the ceramic layer (18) is deposited that adheres to the bond coat (16) through mechanical interlocking with the rough surface of the second coat layer (16b).
IPC 1-7
IPC 8 full level
C23C 4/02 (2006.01); C23C 28/00 (2006.01)
CPC (source: EP)
C23C 4/02 (2013.01); C23C 28/321 (2013.01); C23C 28/3215 (2013.01); C23C 28/325 (2013.01); C23C 28/345 (2013.01); C23C 28/3455 (2013.01)
Designated contracting state (EPC)
CH DE FR GB IT LI SE
DOCDB simple family (publication)
WO 9943861 A1 19990902; CZ 20004537 A3 20020116; CZ 300909 B6 20090909; DE 69925590 D1 20050707; DE 69925590 T2 20060427; EP 1076727 A1 20010221; EP 1076727 B1 20050601
DOCDB simple family (application)
US 9904339 W 19990226; CZ 20004537 A 19990226; DE 69925590 T 19990226; EP 99908549 A 19990226