Global patent index - EP 1077876 A1

EP 1077876 A1 2001-02-28 - METHOD FOR PACKAGING HOT-MELT ADHESIVES

Title (en)

METHOD FOR PACKAGING HOT-MELT ADHESIVES

Title (de)

VERFAHREN ZUM VERPACKEN VON SCHMELZKLEBSTOFF

Title (fr)

PROCEDE POUR EMBALLER DES COLLES A FUSION

Publication

EP 1077876 A1 (DE)

Application

EP 99924866 A

Priority

  • DE 19821399 A
  • EP 9903001 W

Abstract (en)

[origin: DE19913034A1] Packaging of hot-melt adhesive comprises filling part of a film with hot-melt adhesive, sealing off to give an adhesive-free zone, cooling, and further filling. Packaging of hot-melt adhesive comprises filling part of a film, with no surface adhesiveness at storage temperatures and particularly 50 deg C, with hot-melt adhesive, sealing off to give an adhesive-free zone, cooling, and further filling with adhesive.

IPC 1-7 (main, further and additional classification)

B65B 63/08

IPC 8 full level (invention and additional information)

B65B 63/08 (2006.01)

CPC (invention and additional information)

B65B 63/08 (2013.01)

Citation (search report)

See references of WO 9958403A1

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

EPO simple patent family

DE 19913034 A1 19991118; AR 019290 A1 20020213; AU 4137499 A 19991129; BR 9911777 A 20010206; EP 1077876 A1 20010228; WO 9958403 A1 19991118

INPADOC legal status

2003-05-02 [18D] DEEMED TO BE WITHDRAWN

- Ref Legal Event Code: 18D

- Effective date: 20021017

2002-07-24 [17Q] FIRST EXAMINATION REPORT

- Ref Legal Event Code: 17Q

- Effective date: 20020606

2001-02-28 [17P] REQUEST FOR EXAMINATION FILED

- Ref Legal Event Code: 17P

- Effective date: 20001104

2001-02-28 [AK] DESIGNATED CONTRACTING STATES:

- Ref Legal Event Code: AK

- Designated State(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE