EP 1078397 A1 20010228 - METHOD FOR METALLIZING AN ELECTRIC COMPONENT AND ELECTRIC COMPONENT
Title (en)
METHOD FOR METALLIZING AN ELECTRIC COMPONENT AND ELECTRIC COMPONENT
Title (de)
VERFAHREN ZUR KONTAKTIERUNG EINES ELEKTRISCHEN BAUELEMENTS UND ELEKTRISCHES BAUELEMENT
Title (fr)
PROCEDE POUR LA METALLISATION D'UN COMPOSANT ELECTRIQUE, ET COMPOSANT ELECTRIQUE AINSI OBTENU
Publication
Application
Priority
- DE 9901059 W 19990401
- DE 19816245 A 19980411
Abstract (en)
[origin: DE19816245A1] In the semiconductor substrate are formed contact bores filled with electrically conductive material, with the bores insulated from the substrate, but are conductively coupled to the component. On the rear side of the substrate are formed contacts in electric contact with the contact bores. The formation of contact bores comprises lithographic defining and plasma etching of the contact bores. Typically the contact bores are filled with tungsten or copper. In the contact bores is deposited an insulating SiO2 film and an adhesive layer for the conductive material.
IPC 1-7
IPC 8 full level
H01L 23/48 (2006.01)
CPC (source: EP)
H01L 23/481 (2013.01); H01L 2924/0002 (2013.01)
Citation (search report)
See references of WO 9956315A1
Designated contracting state (EPC)
AT BE DE FR GB
DOCDB simple family (publication)
DE 19816245 A1 19991021; EP 1078397 A1 20010228; WO 9956315 A1 19991104
DOCDB simple family (application)
DE 19816245 A 19980411; DE 9901059 W 19990401; EP 99947053 A 19990401