Global Patent Index - EP 1078451 A1

EP 1078451 A1 20010228 - ELECTRONIC COMPONENT

Title (en)

ELECTRONIC COMPONENT

Title (de)

ELEKTRONISCHES BAUELEMENT

Title (fr)

COMPOSANT ELECTRONIQUE

Publication

EP 1078451 A1 20010228 (DE)

Application

EP 99920557 A 19990325

Priority

  • DE 9900895 W 19990325
  • DE 19818824 A 19980427

Abstract (en)

[origin: DE19818824A1] The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strips and the like), a base plate (3) with external contact elements contacting the electric conductive structures of the chip and a hermetically sealed frame (4) mounted on the base plate, the chip being arranged inside and at a distance from said frame. The area between the chip (2) and the base plate (3) is sealed off with a foil (5), the area between the frame (4) and the foil (5) is filled with a sealing compound (6) and the chip (2) along with the sealing compound (6) and the frame (4) are protected by a cover (7) or a protective cap made of galvanic material, the edges (8) of which rest on the base plate (3) hermetically sealing the latter.

IPC 1-7

H03H 3/08; H03H 9/10; H03H 9/05

IPC 8 full level

H01L 23/02 (2006.01); H03H 3/08 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H03H 9/25 (2006.01)

CPC (source: EP KR US)

H03H 9/1078 (2013.01 - EP KR US); H03H 3/08 (2013.01 - KR); H03H 9/1071 (2013.01 - KR); H03H 9/1092 (2013.01 - KR); Y10T 29/42 (2015.01 - EP US); Y10T 29/4913 (2015.01 - EP US); Y10T 29/49146 (2015.01 - EP US); Y10T 29/49171 (2015.01 - EP US); Y10T 29/49172 (2015.01 - EP US)

Citation (search report)

See references of WO 9956390A1

Designated contracting state (EPC)

CH DE FR GB LI

DOCDB simple family (publication)

DE 19818824 A1 19991104; DE 19818824 B4 20080731; CA 2330039 A1 19991104; CN 1127202 C 20031105; CN 1298571 A 20010606; EP 1078451 A1 20010228; JP 2002513234 A 20020508; KR 20010042990 A 20010525; US 6519822 B1 20030218; WO 9956390 A1 19991104

DOCDB simple family (application)

DE 19818824 A 19980427; CA 2330039 A 19990325; CN 99805225 A 19990325; DE 9900895 W 19990325; EP 99920557 A 19990325; JP 2000546452 A 19990325; KR 20007011827 A 20001024; US 69932100 A 20001030