EP 1080031 B1 20071226 - METHOD AND APPARATUS FOR DISPENSING LIQUIDS AND SOLIDS
Title (en)
METHOD AND APPARATUS FOR DISPENSING LIQUIDS AND SOLIDS
Title (de)
VERFAHREN UND VORRICHTUNG ZUR ABFÜLLUNG VON FLÜSSIGKEITEN UND FESTSTOFFEN
Title (fr)
PROCEDE ET APPAREIL DE DISTRIBUTION DE LIQUIDES ET DE SOLIDES
Publication
Application
Priority
- US 9904024 W 19990224
- US 3240498 A 19980227
Abstract (en)
[origin: US6913166B2] A system for metering and dispensing single and plural component liquids and solids as described herein. The dispensing system has a microprocessor-based control system and progressive cavity pumps which provide a very accurate control of component ratios, shot sizes, flow rates and dispense durations. The system has numerous feedback components for accurately controlling the pressure, flow rates, fluid levels and amounts of fluids dispensed. Where a valved nozzle is used, the pressure in the flow system is used to control the pumps rather than the valve. Such a system may be used as a sprayer with compressed air added. Drum rams are associated with the supply drums and the progressive cavity pumps may be placed on the drum ram. Maintenance of a steady state in the system is accomplished with back and forth movement of the pump, with compensation for pressure changes. Absolute rotational position of the pump can be monitored when a set pressure is maintained, to diagnose system conditions. A high flow system uses ball valves and a releasably coupled manifold. A mold charging system uses pressure to control the pumps which are cycled on and off to avoid overpressurizing the mold. The rate of pressure increase is used to control the rate of flow from the pumps as the mold approaches completion of the charge, again to avoid overpressurizing the mold. A signal controlled by a timer can indicate elapsed time as a warning that material within the mixer conduit is hardening to a condition such that flow cannot be reinitiated.
IPC 8 full level
B67B 7/00 (2006.01); B05B 7/32 (2006.01); B05B 12/14 (2006.01); G05D 16/20 (2006.01); G05D 27/02 (2006.01)
CPC (source: EP US)
B05B 7/32 (2013.01 - EP US); B05B 12/1418 (2013.01 - EP US); B29B 7/325 (2013.01 - EP); B29B 7/603 (2013.01 - EP); B29B 7/726 (2013.01 - EP US); B29B 7/728 (2013.01 - EP US); B29B 7/748 (2013.01 - EP US); B29B 7/94 (2013.01 - EP US); G05D 16/2066 (2013.01 - EP US)
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
WO 9943606 A1 19990902; AT E382026 T1 20080115; AU 2786299 A 19990915; CA 2321818 A1 19990902; CA 2321818 C 20091229; DE 69937827 D1 20080207; DE 69937827 T2 20081224; EP 1080031 A1 20010307; EP 1080031 A4 20050803; EP 1080031 B1 20071226; US 2001000611 A1 20010503; US 2004104244 A1 20040603; US 5992686 A 19991130; US 6161723 A 20001219; US 6675988 B2 20040113; US 6913166 B2 20050705
DOCDB simple family (application)
US 9904024 W 19990224; AT 99908426 T 19990224; AU 2786299 A 19990224; CA 2321818 A 19990224; DE 69937827 T 19990224; EP 99908426 A 19990224; US 3240498 A 19980227; US 45141199 A 19991130; US 71993603 A 20031120; US 74135600 A 20001219