Global Patent Index - EP 1080616 A1

EP 1080616 A1 20010307 - METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS

Title (en)

METHOD FOR IMPROVING THE MANUFACTURING SAFETY OF WELD JOINTS

Title (de)

VERFAHREN ZUR ERHÖHUNG DER FERTIGUNGSSICHERHEIT VON LÖTVERBINDUNGEN

Title (fr)

PROCEDE PERMETTANT D'AUGMENTER LA SECURITE DE FABRICATION DE LIAISONS SOUDEES

Publication

EP 1080616 A1 20010307 (DE)

Application

EP 00909014 A 20000208

Priority

  • DE 0000377 W 20000208
  • DE 19910078 A 19990308

Abstract (en)

[origin: WO0054561A1] The invention relates to a method of improving the manufacturing safety of weld joints (7) between a ceramic support (1) and a printed-circuit board (10). Said method consists of the deposition of a first metallization layer (5) resistant to alloy breakdown on the ceramic support (1), followed by the imprinting of a second metallization layer (6), which enhances wetting behaviour, on the first metallization layer (5). In this way the thickness of the overall metallization layer (5, 6) can be increased in the area of the edges (8) of a weld joint (7). The resulting raised solder ring in turn permits the fully automatic optical control of the weld joint (7).

IPC 1-7

H05K 3/40; H05K 3/24; H05K 3/34; H01L 23/498

IPC 8 full level

B23K 1/00 (2006.01); B23K 1/20 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H05K 1/09 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01)

CPC (source: EP US)

H05K 3/3442 (2013.01 - EP US); H05K 3/403 (2013.01 - EP US); H05K 1/092 (2013.01 - EP US); H05K 3/0052 (2013.01 - EP US); H05K 3/248 (2013.01 - EP US); H05K 3/4061 (2013.01 - EP US); H05K 2201/035 (2013.01 - EP US); H05K 2201/09181 (2013.01 - EP US); H05K 2201/10909 (2013.01 - EP US); Y02P 70/50 (2015.11 - EP US)

Citation (search report)

See references of WO 0054561A1

Designated contracting state (EPC)

DE FR GB

DOCDB simple family (publication)

WO 0054561 A1 20000914; DE 19910078 A1 20000928; EP 1080616 A1 20010307; JP 2002538967 A 20021119; US 6488199 B1 20021203

DOCDB simple family (application)

DE 0000377 W 20000208; DE 19910078 A 19990308; EP 00909014 A 20000208; JP 2000604658 A 20000208; US 67493900 A 20001229