Global Patent Index - EP 1080926 A3

EP 1080926 A3 20010620 - Method of and apparatus for making stencil

Title (en)

Method of and apparatus for making stencil

Title (de)

Vorrichtung und Verfahren zum Herstellen von Schablonen

Title (fr)

Méthode et appareil de fabrication de stencil

Publication

EP 1080926 A3 20010620 (EN)

Application

EP 00118788 A 20000830

Priority

  • JP 24583999 A 19990831
  • JP 24584099 A 19990831
  • JP 24623099 A 19990831

Abstract (en)

[origin: EP1080926A2] A stencil is made by the use of a thermal head which has an array of resistance heater element arranged in a main scanning direction. The resistance heater elements are selectively driven while the stencil material is conveyed in a sub-scanning direction intersecting the main scanning direction so that perforations are formed in the stencil material in a predetermined size at a first pitch in the main scanning direction and a second pitch in the sub-scanning direction. The stencil material is perforated so that unperforated portions which continuously extend in one of the main scanning direction and the sub-scanning direction to separate perforations in the other of the main scanning direction and the sub-scanning direction are left in the stencil material. <IMAGE>

IPC 1-7

B41J 2/355; B41C 1/14; B41J 2/35; B41J 2/345; B41J 2/335

IPC 8 full level

B41C 1/14 (2006.01); B41J 2/355 (2006.01)

CPC (source: EP)

B41C 1/144 (2013.01); B41J 2/355 (2013.01); B41C 1/14 (2013.01); B41J 2202/32 (2013.01)

Citation (search report)

  • [E] EP 1063092 A1 20001227 - RISO KAGAKU CORP [JP]
  • [XY] US 5809879 A 19980922 - YOKOYAMA YASUMITSU [JP], et al
  • [A] US 5216951 A 19930608 - YOKOYAMA YASUMITSU [JP], et al
  • [A] US 5592209 A 19970107 - HASEGAWA TAKANORI [JP], et al
  • [Y] PATENT ABSTRACTS OF JAPAN vol. 010, no. 234 (M - 507) 14 August 1986 (1986-08-14)
  • [X] PATENT ABSTRACTS OF JAPAN vol. 016, no. 282 (M - 1269) 23 June 1992 (1992-06-23)
  • [A] PATENT ABSTRACTS OF JAPAN vol. 1997, no. 03 31 March 1997 (1997-03-31)

Designated contracting state (EPC)

AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

DOCDB simple family (publication)

EP 1080926 A2 20010307; EP 1080926 A3 20010620

DOCDB simple family (application)

EP 00118788 A 20000830