EP 1081201 A1 20010307 - Sealing material composition for cards and process for producing cards using the composition
Title (en)
Sealing material composition for cards and process for producing cards using the composition
Title (de)
Versiegelungsmaterialzusammensetzung für Karten und Verfahren zur Herstellung von Karten unter Verwendung der Zusammensetzung
Title (fr)
Composition de matériau de scellement pour cartes et procédé de fabrication de cartes utilisant cette composition
Publication
Application
Priority
JP 24927499 A 19990902
Abstract (en)
A sealing material composition for cards which comprises (A) an acrylate compound polymerizable by an ionizing radiation and (B) 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing cards comprising disposing a coating layer comprising the above sealing material composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation. The sealing material composition gives excellent adhesion between a substrate sheet and a cover sheet and provides cards having faces with little unevenness, suitable flexibility and excellent reliability. The process provides cards having the above characteristics. <IMAGE>
IPC 1-7
IPC 8 full level
G06K 19/07 (2006.01); C09J 4/00 (2006.01); C09J 4/02 (2006.01); C09J 175/00 (2006.01); C09K 3/10 (2006.01); G06K 19/02 (2006.01); G06K 19/077 (2006.01); H01L 23/29 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP KR US)
C09J 4/00 (2013.01 - KR); C09K 3/10 (2013.01 - KR); G06K 19/02 (2013.01 - EP US); G06K 19/07 (2013.01 - KR); G06K 19/07749 (2013.01 - EP US); G06K 19/07779 (2013.01 - EP US); G06K 19/07783 (2013.01 - EP US); H01L 23/293 (2013.01 - EP US); H05K 3/284 (2013.01 - EP US); H01L 2924/0002 (2013.01 - EP US); Y10S 428/901 (2013.01 - EP US); Y10T 428/24917 (2015.01 - EP US)
Citation (search report)
- [A] EP 0768353 A1 19970416 - NIPPON KAYAKU KK [JP]
- [A] EP 0835917 A1 19980415 - NIPPON KAYAKU KK [JP]
- [A] EP 0935288 A2 19990811 - LINTEC CORP [JP]
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
EP 1081201 A1 20010307; EP 1081201 B1 20050209; CN 1174055 C 20041103; CN 1287139 A 20010314; DE 60017997 D1 20050317; DE 60017997 T2 20050707; JP 2001072960 A 20010321; KR 100352925 B1 20020916; KR 20010050318 A 20010615; SG 86433 A1 20020219; TW 502058 B 20020911; US 6592973 B1 20030715
DOCDB simple family (application)
EP 00116279 A 20000809; CN 00126453 A 20000901; DE 60017997 T 20000809; JP 24927499 A 19990902; KR 20000051817 A 20000902; SG 200004560 A 20000817; TW 89117478 A 20000829; US 64195100 A 20000821