EP 1081252 A1 20010307 - Selective plating method
Title (en)
Selective plating method
Title (de)
Verbessertes selektives Plattierungsverfahren
Title (fr)
Procédé de placage sélectif
Publication
Application
Priority
EP 99202857 A 19990902
Abstract (en)
The invention relates to a process for providing objects with a metal plating. More specifically it relates to electrolytically plating of objects, which objects comprise areas that should be plated and areas that should not be plated. It has been found that the ratio between the thickness of the plating layer on the areas that should not be plated, and the areas that should be plated can be lowered by first plating both areas and then removing parts of the plated layers by stripping.
IPC 1-7
IPC 8 full level
C25D 5/02 (2006.01); C25D 7/00 (2006.01); C25F 5/00 (2006.01)
CPC (source: EP)
C25D 5/022 (2013.01); C25D 7/04 (2013.01); C25F 5/00 (2013.01)
Citation (search report)
- [X] EP 0410955 A1 19910130 - ANDRITZ AG MASCHF [AT]
- [X] US 5098534 A 19920324 - NAKAMURA TAICHI [JP], et al
Designated contracting state (EPC)
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
DOCDB simple family (publication)
DOCDB simple family (application)
EP 99202857 A 19990902; US 0020808 W 20000831