EP 1082471 A1 20010314 - METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER
Title (en)
METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER
Title (de)
VERFAHREN ZUM ÜBERZIEHEN VON OBERFLÄCHEN AUF KUPFER ODER EINER KUPFERLEGIERUNG MIT EINER ZINN- ODER ZINNLEGIERUNGSSCHICHT
Title (fr)
PROCEDE POUR RECOUVRIR DES SURFACES DE CUIVRE OU D'ALLIAGE DE CUIVRE AVEC UNE COUCHE D'ETAIN OU D'ALLIAGE D'ETAIN
Publication
Application
Priority
- DE 9901176 W 19990415
- DE 19818910 A 19980423
Abstract (en)
[origin: WO9955935A1] Sufficiently good soldering results can not be obtained using known methods for tinning copper surfaces. In particular, the surfaces remain incapable of being soldered after thermal treatment. To eliminate this problem, a method is used for coating surfaces of copper or of a copper alloy with a layer made of tin or of a tin alloy. Said method comprises the essential following steps: a) treating the surfaces with a solution containing at least one noble metal compound in order to deposit noble metal; b) treating the surfaces which are coated with noble metal according to step a) with a solution containing at least one tin compound, at least one acid and at least one complexing agent for copper from the group comprised of thiourea and the derivatives thereof in order to form the tin or tin alloy layer.
IPC 1-7
IPC 8 full level
C23C 18/28 (2006.01); C23C 18/31 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP KR)
C23C 18/1844 (2013.01 - EP); C23C 18/28 (2013.01 - KR); C23C 18/31 (2013.01 - EP); H05K 3/244 (2013.01 - EP)
Citation (search report)
See references of WO 9955935A1
Designated contracting state (EPC)
AT BE DE DK ES FI FR GB IE IT NL PT SE
DOCDB simple family (publication)
WO 9955935 A1 19991104; CA 2326049 A1 19991104; CN 1297490 A 20010530; EP 1082471 A1 20010314; JP 2002513090 A 20020508; KR 20010042625 A 20010525
DOCDB simple family (application)
DE 9901176 W 19990415; CA 2326049 A 19990415; CN 99805208 A 19990415; EP 99927684 A 19990415; JP 2000546074 A 19990415; KR 20007011306 A 20001011