Global Patent Index - EP 1082471 A1

EP 1082471 A1 2001-03-14 - METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER

Title (en)

METHOD FOR COATING SURFACES OF COPPER OR OF A COPPER ALLOY WITH A TIN OR TIN ALLOY LAYER

Title (de)

VERFAHREN ZUM ÜBERZIEHEN VON OBERFLÄCHEN AUF KUPFER ODER EINER KUPFERLEGIERUNG MIT EINER ZINN- ODER ZINNLEGIERUNGSSCHICHT

Title (fr)

PROCEDE POUR RECOUVRIR DES SURFACES DE CUIVRE OU D'ALLIAGE DE CUIVRE AVEC UNE COUCHE D'ETAIN OU D'ALLIAGE D'ETAIN

Publication

EP 1082471 A1 (DE)

Application

EP 99927684 A

Priority

  • DE 9901176 W
  • DE 19818910 A

Abstract (en)

[origin: WO9955935A1] Sufficiently good soldering results can not be obtained using known methods for tinning copper surfaces. In particular, the surfaces remain incapable of being soldered after thermal treatment. To eliminate this problem, a method is used for coating surfaces of copper or of a copper alloy with a layer made of tin or of a tin alloy. Said method comprises the essential following steps: a) treating the surfaces with a solution containing at least one noble metal compound in order to deposit noble metal; b) treating the surfaces which are coated with noble metal according to step a) with a solution containing at least one tin compound, at least one acid and at least one complexing agent for copper from the group comprised of thiourea and the derivatives thereof in order to form the tin or tin alloy layer.

IPC 1-7 (main, further and additional classification)

C23C 18/28; C23C 18/31; H05K 3/24

IPC 8 full level (invention and additional information)

C23C 18/28 (2006.01); C23C 18/31 (2006.01); H05K 3/24 (2006.01)

CPC (invention and additional information)

H05K 3/244 (2013.01); C23C 18/1844 (2013.01); C23C 18/31 (2013.01)

Citation (search report)

See references of WO 9955935A1

Designated contracting state (EPC)

AT BE DE DK ES FI FR GB IE IT NL PT SE

EPO simple patent family

WO 9955935 A1 19991104; CA 2326049 A1 19991104; CN 1297490 A 20010530; EP 1082471 A1 20010314; JP 2002513090 A 20020508

INPADOC legal status


2007-11-23 [REG HK WD] APPLICATIONS WITHDRAWN, DEEMED TO BE WITHDRAWN, OR REFUSED AFTER PUBLICATION IN HONG KONG

- Document: HK 1033156

2002-10-02 [18R] REFUSED

- Effective date: 20020509

2002-01-02 [17Q] FIRST EXAMINATION REPORT

- Effective date: 20011113

2001-03-14 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000913

2001-03-14 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A1

- Designated State(s): AT BE DE DK ES FI FR GB IE IT NL PT SE