Global Patent Index - EP 1084029 A2

EP 1084029 A2 2001-03-21 - ELECTRONIC DEVICES HAVING THERMODYNAMIC ENCAPSULANT PORTIONS PREDOMINATING OVER THERMOSTATIC ENCAPSULANT PORTIONS

Title (en)

ELECTRONIC DEVICES HAVING THERMODYNAMIC ENCAPSULANT PORTIONS PREDOMINATING OVER THERMOSTATIC ENCAPSULANT PORTIONS

Title (de)

ELEKTRONISCHE ANORDNUNG MIT THERMODYNAMISCHEN VERPACKUNGSTEILEN, VORHERSCHEND ÜBER THERMOSTATISCHE VERPACKUNGSTEILE

Title (fr)

DISPOSITIFS ELECTRONIQUES AYANT DES PARTIES THERMODYNAMIQUES ENCAPSULANTES PREDOMINANT SUR DES PARTIES THERMOSTATIQUES ENCAPSULANTES

Publication

EP 1084029 A2 (EN)

Application

EP 99905475 A

Priority

  • US 9901585 W
  • US 7270098 P
  • US 7630698 P

Abstract (en)

[origin: WO9938196A2] An electronic device (10) and a method for assembling the device (10) comprising a circuit board (14) having contacts (24, 26) and an integrated circuit chip (12) of a given physical geometry, the chip (12) having leads (18, 22) electrically connected in hot-solder relation to the contacts (24, 26) the chip (12) having a protected composition congruent therewith and adhering thereto, the composition comprising a resin (28) having thermostatic crystalline polymer chain portions and thermodynamic polymer chain portions, the thermodynamic chain portions being present in such proportion that they expansively absord the heat of the hot-solder connection in preference to the thermostatic crystalline polymer chain portions. Thus, the protective composition remains comgruent with and adheres to the physical geometry of the chip (12) through a soldering cycle.

[origin: WO9938196A2] A method for and an electronic device comprising a circuit board having a contact and an integrated circuit chip of a given physical geometry, the chip having a lead electrically connected in hot-soldered relation to the contact, the chip having a protective composition congruent therewith and adhering thereto, the composition comprising a resin having thermostatic crystalline polymer chain portions and thermodynamic polymer chain portions, the thermodynamic polymer chain portions being present in such proportion that they expansively absorb the heat of the hot solder connection in preference to the thermostatic crystalline polymer chain portions. Thus, the protective composition remains congruent with and adheres to the physical geometry of the chip through a soldering cycle.

IPC 1-7 (main, further and additional classification)

B32B 5/16; B32B 27/06; B32B 27/04

IPC 8 full level (invention and additional information)

C08G 18/32 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)

CPC (invention and additional information)

H01L 23/3121 (2013.01); H01L 23/293 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01)

Combination set (CPC)

  1. H01L 2224/73265 + H01L 2224/32225 + H01L 2224/48227 + H01L 2924/00
  2. H01L 2924/15747 + H01L 2924/00
  3. H01L 2224/45144 + H01L 2924/00014
  4. H01L 2224/45124 + H01L 2924/00014
  5. H01L 2224/45144 + H01L 2924/00015
  6. H01L 2924/14 + H01L 2924/00
  7. H01L 2924/181 + H01L 2924/00012

Designated contracting state (EPC)

DE FR GB IT

EPO simple patent family

WO 9938196 A2 19990729; WO 9938196 A3 20000615; EP 1084029 A2 20010321; EP 1084029 A4 20030514; JP 2002502110 A 20020122

INPADOC legal status


2006-02-08 [18D] DEEMED TO BE WITHDRAWN

- Effective date: 20050701

2003-05-14 [A4] SUPPLEMENTARY SEARCH REPORT

- Effective date: 20030327

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7C 08G 18/69 A

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7C 08G 18/10 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7C 08G 18/65 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7H 01L 23/29 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7H 01L 23/31 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7B 32B 27/06 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7B 32B 27/04 B

2003-05-14 [RIC1] CLASSIFICATION (CORRECTION)

- IPC: 7B 32B 5/16 B

2001-03-21 [17P] REQUEST FOR EXAMINATION FILED

- Effective date: 20000722

2001-03-21 [AK] DESIGNATED CONTRACTING STATES:

- Kind Code of Ref Document: A2

- Designated State(s): DE FR GB IT