EP 1084029 A4 20030514 - ELECTRONIC DEVICES HAVING THERMODYNAMIC ENCAPSULANT PORTIONS PREDOMINATING OVER THERMOSTATIC ENCAPSULANT PORTIONS
Title (en)
ELECTRONIC DEVICES HAVING THERMODYNAMIC ENCAPSULANT PORTIONS PREDOMINATING OVER THERMOSTATIC ENCAPSULANT PORTIONS
Title (de)
ELEKTRONISCHE ANORDNUNG MIT THERMODYNAMISCHEN VERPACKUNGSTEILEN, VORHERSCHEND ÜBER THERMOSTATISCHE VERPACKUNGSTEILE
Title (fr)
DISPOSITIFS ELECTRONIQUES AYANT DES PARTIES THERMODYNAMIQUES ENCAPSULANTES PREDOMINANT SUR DES PARTIES THERMOSTATIQUES ENCAPSULANTES
Publication
Application
Priority
- US 9901585 W 19990126
- US 7270098 P 19980127
- US 7630698 P 19980227
Abstract (en)
[origin: WO9938196A2] A method for and an electronic device comprising a circuit board having a contact and an integrated circuit chip of a given physical geometry, the chip having a lead electrically connected in hot-soldered relation to the contact, the chip having a protective composition congruent therewith and adhering thereto, the composition comprising a resin having thermostatic crystalline polymer chain portions and thermodynamic polymer chain portions, the thermodynamic polymer chain portions being present in such proportion that they expansively absorb the heat of the hot solder connection in preference to the thermostatic crystalline polymer chain portions. Thus, the protective composition remains congruent with and adheres to the physical geometry of the chip through a soldering cycle.
[origin: WO9938196A2] An electronic device (10) and a method for assembling the device (10) comprising a circuit board (14) having contacts (24, 26) and an integrated circuit chip (12) of a given physical geometry, the chip (12) having leads (18, 22) electrically connected in hot-solder relation to the contacts (24, 26) the chip (12) having a protected composition congruent therewith and adhering thereto, the composition comprising a resin (28) having thermostatic crystalline polymer chain portions and thermodynamic polymer chain portions, the thermodynamic chain portions being present in such proportion that they expansively absord the heat of the hot-solder connection in preference to the thermostatic crystalline polymer chain portions. Thus, the protective composition remains comgruent with and adheres to the physical geometry of the chip (12) through a soldering cycle.
IPC 1-7
C08G 18/69; C08G 18/10; C08G 18/65; H01L 23/29; H01L 23/31; B32B 27/06; B32B 27/04; B32B 5/16
IPC 8 full level
C08G 18/32 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01)
CPC (source: EP)
H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01)
Citation (search report)
- [X] US 4130546 A 19781219 - GOTO KAZUO, et al
- [X] WO 9515579 A1 19950608 - GIAT IND SA [FR], et al
- [X] DE 19513914 A1 19951019 - VAGNONE & BOERI [IT]
- See references of WO 9938196A2
Designated contracting state (EPC)
DE FR GB IT
DOCDB simple family (publication)
WO 9938196 A2 19990729; WO 9938196 A3 20000615; EP 1084029 A2 20010321; EP 1084029 A4 20030514; JP 2002502110 A 20020122
DOCDB simple family (application)
US 9901585 W 19990126; EP 99905475 A 19990126; JP 2000528997 A 19990126