EP 1086177 A1 20010328 - THERMOPLASTIC MOULDING MATERIALS
Title (en)
THERMOPLASTIC MOULDING MATERIALS
Title (de)
THERMOPLASTISCHE FORMMASSEN
Title (fr)
MATIERES MOULABLES THERMOPLASTIQUES
Publication
Application
Priority
- DE 19817218 A 19980417
- EP 9902318 W 19990406
Abstract (en)
[origin: DE19817218A1] Use of polyisobutylene to improve the flow and extrusion characteristics of thermoplastic molding materials based on acrylic elastomer core/hard styrene shell graft polymer particles, styrene resin and styrene-butadiene resin. Thermoplastic molding materials comprising: (A) 20-98 wt.% of a particulate graft copolymer with (a1) 30-90 wt.% of a rubbery core of (a1i) 80-99.99 wt.% of a (C1-C10 alkyl)esters of acrylic acid, (a1ii) 0.01-20 wt.% of at least one crosslinking monomer and (a1iii) 0-19.99 wt.% of one or more further monomers, (a2) 10-70 wt.% of a grafted shell of (a2i) 50-100 wt.% of a styrene compound of formula (I), (a2ii) 0-50 wt.% of at least one mono-ethylenically unsaturated nitrile compound and (a2iii) 0-40 wt.% of one or more further monomers; R<1> and R<2> = H or 1-8 C alkyl; n = 0, 1, 2 or 3 (B) 0.5-78.5 wt.% of a thermoplastic polymer of (b1) 50-100 wt.% of a styrene compound of formula (I) above, (b2) 0-50 wt.% of at least one monoethylenically unsaturated nitrile compound and (b3) 0-40 wt.% of one or more further monomers; (C) 1-79 wt.% of a copolymer of (c1) 30-90 wt.% styrene and/or alpha -methylstyrene, (c2)10-70 wt.% butadiene and (c3) 0-30 wt.% of one or more further monomers, in which the olefinic double bonds are completely or almost completely hydrogenated; and (D) 0.5-30 wt.% of a copolymer of (d1) 50-100 wt.% isobutene and (d2) 0-50 wt.% of one or more further monomers.
IPC 1-7
IPC 8 full level
C08F 265/04 (2006.01); C08L 51/00 (2006.01)
CPC (source: EP US)
C08F 265/04 (2013.01 - EP US); C08L 51/003 (2013.01 - EP US)
Citation (search report)
See references of WO 9954401A1
Designated contracting state (EPC)
DE
DOCDB simple family (publication)
DE 19817218 A1 19991021; AU 3333499 A 19991108; EP 1086177 A1 20010328; US 6518361 B1 20030211; WO 9954401 A1 19991028
DOCDB simple family (application)
DE 19817218 A 19980417; AU 3333499 A 19990406; EP 9902318 W 19990406; EP 99914568 A 19990406; US 64767400 A 20001003